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Lead the functional verification of advanced ASICs, overseeing test planning, execution, and coverage analysis, while collaborating with various teams.

The Director of Accounting Operations will lead and scale global accounting processes, oversee financial statements, and drive automation in a semiconductor technology firm.

The Chief of Staff for ASIC Engineering will drive operational cadence, manage escalations, and lead ASIC program management efforts, supporting the Head of Engineering in coordinating cross-functional teams and ensuring project success.

The Manager, Package Design Engineering will oversee the design and execution of IC packaging solutions, mentor a team, and drive collaboration with various engineering and vendor partners to enhance AI infrastructure.

Design and optimize power delivery systems for ASIC products, ensuring robust integrity and developing board-level designs while collaborating with vendors and teams.

Lead the SIPI engineering team to develop high-performance IC packaging solutions, partner across teams, and drive execution from concept through production.

Lead the development of high-speed semiconductor products, focusing on post-silicon product development, RF testing, and characterizing advanced semiconductor solutions.

The Firmware Engineering Manager will oversee BootROM firmware development and simulation modeling, ensuring robust integration of security features and hardware/firmware co-design.

The Senior Firmware Engineer will architect and develop firmware for SoC and systems, working with hardware and ensuring customer needs are understood and met.

Design, develop, and optimize embedded firmware for optical engines and photonic integrated circuits, focusing on control, calibration, and optimization in high-speed systems.