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Lead operational performance in contract manufacturing, ensuring efficiency in production plans, cycle times, and quality; focuses on continuous improvement in high-technology electronics manufacturing.

Lead product reliability qualification and NPI activities for next-generation FPGA/SoC products. Define and execute reliability experiments, perform root-cause and statistical analysis, support production test flows, validate on-chip components, develop automation and scripts (including Agentic AI), and drive corrective actions across cross-functional teams to ensure manufacturability and datasheet compliance.

Provide technical support and training for USB products, debug customer hardware/software implementations, develop evaluation hardware and reference designs, create documentation and application collateral, and collaborate with product marketing and partners to guide product development.

Designs, integrates, validates, and debugs FPGA-based platforms supporting USB and Ethernet PHY products, mixed-signal IP, and SoC solutions. Responsibilities include RTL coding, simulation, synthesis, timing analysis, place-and-route, multi-clock-domain design, performance optimization, board-level bring-up, laboratory debugging, system integration, documentation, and automation of FPGA development flows. The engineer collaborates with digital, analog, hardware, firmware, software, ASIC, verification, and validation teams.

Supports product application engineering for mixed-signal ICs through customer design-in assistance, schematic and layout reviews, board debugging, bench characterization, and development of datasheets, reference designs, application notes, evaluation boards, and design tools. Collaborates with marketing, product management, chip design teams, customers, and internal stakeholders to gather requirements and support new product launches.

Design and develop low-noise VCSO/SAW products: define requirements with stakeholders, perform RF/DC circuit and PCB design, run EM/thermal/Monte-Carlo simulations, prototype and test using lab analyzers, support production yield and failure analysis, and prepare manufacturing tools and documentation.

Lead and develop a global applications engineering organization for Analog Power products. Set strategy and roadmaps with marketing and engineering, manage resource allocation, enable FAEs, drive cross-functional new product execution, engage with clients and IC architects, and monitor market and competitive trends to deliver system-level power solutions.

Maintain and optimize implant equipment to meet fab manufacturing goals. Act as tool expert: troubleshoot downtime, manage PMs and spare parts, write/update PM procedures, arrange vendor support, and drive uptime and cost-reduction projects. Support continuous improvement, qualify components, analyze watchdog data, assist area manager with training, and act as area lead as needed.

Lead triage and resolution of hardware, firmware, and software vulnerabilities across semiconductor products; perform technical assessments (CVSS), coordinate remediations and disclosures, author advisories, run SBOM/VEX analysis, and support regulatory and standards readiness (CRA, IEC 62443, ISO/SAE 21434) across engineering and compliance teams.

Provide cybersecurity engineering and architecture for mission and enterprise systems, translate NIST/CNSS controls into secure designs, troubleshoot Linux/Windows servers and endpoints, Cisco network devices, and enterprise storage, implement continuous monitoring (vulnerability scanning, SIEM), perform technical security assessments using Tenable and DISA STIGs, prioritize risk, and lead remediation efforts to maintain compliance and mission assurance.