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Reposted YesterdaySaved
In-Office
West Lafayette, IN, USA
160K-190K Annually
Senior level
160K-190K Annually
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead analog and mixed-signal IP design, verification, and integration for Wi-R SoCs. Drive RF IC architecture through post-silicon bring-up, collaborate with firmware/digital/board teams, mentor junior engineers, and publish technical results. Own end-to-end chip development and long-term technical strategy for ultra-low-power wireless silicon.
Top Skills: AdsAltiumEagleLabviewLtspiceOrcadPythonRf Lab ToolsWi-R
Reposted YesterdaySaved
In-Office
West Lafayette, IN, USA
Expert/Leader
Expert/Leader
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead and grow a world-class IC design organization across analog, mixed-signal, RF, and digital domains. Own end-to-end chip lifecycle from concept through GDSII, tapeout, bring-up and production. Set architecture and technical standards, guide EDA tool and vendor engagements, integrate IP, coordinate with hardware/firmware/product teams, hire and mentor engineers, and represent engineering in executive strategy and partnerships.
Top Skills: Analog Ic DesignAsic DevelopmentDigital Ic DesignEda ToolsFirmwareGdsiiHardware Co-DesignIp IntegrationLow-Power DesignMixed-Signal Ic DesignRf SystemsSoc ArchitectureTapeoutWi-R
Reposted 5 Days AgoSaved
In-Office
West Lafayette, IN, USA
115K-150K Annually
Senior level
115K-150K Annually
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead bare-metal bring-up of Wi-R SoCs and Cortex-M/RISC-V platforms, develop and optimize ultra-low-power firmware stacks (I2C, SPI, BLE, DMA, sensor drivers), deliver a production-ready firmware SDK, debug at register level using oscilloscopes and JTAG, mentor junior engineers, and drive toolchain and quality standards across teams.
Top Skills: Bare-Metal Embedded CBleCC++Cortex-MDmaI2CJtagMcuOscilloscopeRisc-VSensor DriversSpiWi-R
Reposted 6 Days AgoSaved
In-Office
West Lafayette, IN, USA
Internship
Internship
Artificial Intelligence • Hardware • Wearables • Semiconductor
Work on embedded hardware and FPGA-based wearable systems: assist with schematic capture, multilayer PCB layout, component selection, prototyping, board bring-up, validation, testing, and debugging. Support FPGA implementations for signal processing and interface logic while collaborating with product, industrial design, and supply chain teams.
Top Skills: FpgaI2CI2SIntel/AlteraMcuMipiPcb LayoutSchematic CaptureSignal ProcessingSpiUartUsbXilinx
Reposted 6 Days AgoSaved
In-Office
West Lafayette, IN, USA
95K-216K Annually
Senior level
95K-216K Annually
Senior level
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead design, simulation, prototyping, and launch of wearable embedded hardware. Own schematics, multilayer PCB layout, system integration, component selection, validation, bring-up, and cross-functional coordination for smart devices.
Top Skills: Analog Circuit DesignBoard Bring-UpEmbedded SystemsGpsI2CI2SLow-Power HardwareMipiMixed-Signal PcbMultilayer PcbPcb LayoutRf (Bluetooth)Rf (Wi‑Fi)Signal IntegritySpiUartUsbWi-R
Reposted 6 Days AgoSaved
In-Office
West Lafayette, IN, USA
Internship
Internship
Artificial Intelligence • Hardware • Wearables • Semiconductor
Work on designing, simulating, and prototyping ultra-low-power wearable and biomedical hardware. Support schematic capture, multilayer PCB layout, component selection, system integration, bring-up, validation, and testing for devices like smartglasses, rings, and watches while collaborating across design, product, and supply chain teams.
Top Skills: Analog CircuitsAudio CircuitsBluetoothBoard Bring-UpEmbedded SystemsGpsHardware PrototypingI2CI2SLow-Power HardwareMipiMultilayer Pcb LayoutPcb DesignRf CommunicationSchematic CaptureSpiUartUsbWi-FiWi-R
Reposted 6 Days AgoSaved
In-Office
West Lafayette, IN, USA
175K-225K Annually
Expert/Leader
175K-225K Annually
Expert/Leader
Artificial Intelligence • Hardware • Wearables • Semiconductor
Lead architecture and execution of next-generation wearable Wi-R SoCs. Build and manage an IC design team, own RTL-to-GDS tape-outs, drive analog/RF front-end and mixed-signal integration, define verification/IP reuse methodology, and coordinate silicon validation, packaging, and product co-optimization with cross-functional teams.
Top Skills: Analog Ic DesignAsicBluetoothCadenceDftEsdFloorplanningGdsLow-Power Wireless SocsMixed-SignalNfcPackaging Co-DesignRf Front-EndRtl-To-GdsSensor InterfacesSocTiming ClosureUwbWi-R
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