Design ultra-low-power wearable hardware and help power the future of human-computer interaction.
On‑site – West Lafayette, IN
About IxanaIxana is a Purdue University spinoff pioneering brain-inspired wearable computing. We've developed Wi-R, a patented communication tech that's 100x more energy-efficient than Bluetooth or Wi-Fi. Join our 60-person team building the next era of real-time, AI-powered human-computer interaction.
The Wi-R Revolution
Wi-R is our patented non-radiative near-field communication technology that creates secure "wire-like wireless" experiences through small E-field bubbles around your body. This breakthrough enables unprecedented energy efficiency at sub-0.1 nanojoules per bit, making long-term wearable and implantable devices finally practical.
See Wi-R in action: Visit ixana.ai for demos of high-speed data streaming through skin contact: https://vimeo.com/ixana/pairing-contact-transfer
What You’ll Do
Assist in designing, simulating, and prototyping embedded hardware for wearable and
biomedical applications
Support schematic capture, multilayer PCB layout, and system integration
Collaborate with industrial design, product architecture, and supply chain teams
Help specify components, build custom circuits, and adapt vendor reference designs
Participate in validation, bring-up, testing, and launch activities for smart devices (e.g.,
smartglasses, rings, watches, sensors)
What We’re Looking For
Required:
Strong interest in embedded hardware design and development
Familiarity with analog circuits and debugging techniques
Basic understanding of embedded systems and board bring-up processes
Curiosity to learn about component selection, system integration, and testing
Good problem-solving skills and attention to detail
Preferred:
Experience designing PCBs or working with circuit layouts
Knowledge of low-power hardware, audio circuits, or RF communication (Wi-Fi, Bluetooth, GPS)
Familiarity with interfaces like I2C, SPI, UART, USB, I2S, or MIPI
Prototyping experience and eagerness to work across engineering teams
Compensation & Benefits:
Competitive hourly pay with performance-based bonuses
Relocation support and visa sponsorship (if applicable)
Possibility of equity grants based on role and status
Mentorship from industry experts and engineers
Hands-on experience designing hardware for wearable and biomedical applications
Exposure to deep tech and end-to-end product development in a fast-paced environment
Why Join Us
Work on hardware that advances healthcare and personal technology
Collaborate with experts and learn cutting-edge design techniques
Take ownership and contribute to real projects from start to launch
Grow in a culture that values speed, rigor, and respect
Gain global exposure and career-building experience
Keywords:
Embedded hardware internship, PCB design basics, schematic capture, analog fundamentals, debugging skills, embedded systems basics, board bring-up, system integration, hardware prototyping, component selection
Skills Required
- Strong interest in embedded hardware design and development
- Familiarity with analog circuits and debugging techniques
- Basic understanding of embedded systems and board bring-up processes
- Curiosity to learn about component selection, system integration, and testing
- Good problem-solving skills and attention to detail
- Experience designing PCBs or working with circuit layouts
- Knowledge of low-power hardware, audio circuits, or RF communication (Wi-Fi, Bluetooth, GPS)
- Familiarity with interfaces like I2C, SPI, UART, USB, I2S, or MIPI
- Prototyping experience and eagerness to work across engineering teams
What We Do
Ixana is a Purdue University spinoff and fabless semiconductor company pioneering brain-inspired wearable computing. The company develops Wi-R, a patented E-field wireless technology that provides ultra-low power, high-bandwidth connectivity for wearables, AR/VR, robotics, and industrial applications. Ixana's mission is to enable always-on, low-latency edge AI and high-speed human-computer interfaces by breaking the energy-latency trade-off through confined E-field coupling.








