Launch your hardware career - gain hands-on experience in embedded design and FPGA-based wearable systems.
On‑site – West Lafayette, IN
About IxanaIxana is a Purdue University spinoff pioneering brain-inspired wearable computing. We've developed Wi-R, a patented communication tech that's 100x more energy-efficient than Bluetooth or Wi-Fi. Join our 60-person team building the next era of real-time, AI-powered human-computer interaction.
The Wi-R Revolution
Wi-R is our patented non-radiative near-field communication technology that creates secure "wire-like wireless" experiences through small E-field bubbles around your body. This breakthrough enables unprecedented energy efficiency at sub-0.1 nanojoules per bit, making long-term wearable and implantable devices finally practical.
See Wi-R in action: Visit ixana.ai for demos of high-speed data streaming through skin contact: https://vimeo.com/ixana/pairing-contact-transfer
What You’ll Do
Assist in designing, simulating, and prototyping embedded hardware for wearable and biomedical applications
Support schematic capture, multilayer PCB layout, and system integration tasks
Help specify components, build custom circuits, and adapt vendor reference designs
Assist in validation, bring-up, testing, and debugging of smart devices (e.g., smartglasses, rings, watches, sensors)
Work with FPGA-based solutions for signal processing, interface logic, and performance optimization
Collaborate with industrial design, product architecture, and supply chain teams
What We’re Looking For
Required:
Interest in embedded hardware design, analog circuits, and PCB layout
Basic understanding of board bring-up and hardware debugging techniques
Familiarity with FPGA design tools or coursework (e.g., Xilinx, Intel/Altera) is a plus
Curiosity to learn about integrating FPGA solutions with MCU platforms
Good problem-solving skills and attention to detail
Eagerness to collaborate and grow in a hands-on engineering environment
Preferred:
Experience with or coursework involving I2C, SPI, UART, USB, I2S, or MIPI interfaces
Exposure to low-power hardware, signal processing, or wearable systems
Contributions to hardware projects, open-source designs, or FPGA demos
Compensation & Benefits
Competitive hourly pay with performance-based bonuses
Relocation support and visa sponsorship (if applicable)
Possibility of equity grants based on role and status
Exposure to cutting-edge communication technologies like Wi-R
Hands-on experience designing embedded hardware and FPGA solutions
Why Join Us
Work on technologies that will transform wearable computing
Collaborate with experts and cross-functional teams
Take ownership and contribute to real projects from start to launch
Grow in a fast-paced, supportive environment
Gain hands-on experience with FPGA and embedded hardware design
Keywords:
Embedded hardware internship, FPGA design, PCB layout, schematic capture, analog circuits, board bring-up, hardware debugging, I2C SPI UART, wearable devices, system integration
Skills Required
- Interest in embedded hardware design, analog circuits, and PCB layout
- Basic understanding of board bring-up and hardware debugging techniques
- Familiarity with FPGA design tools or coursework (e.g., Xilinx, Intel/Altera)
- Curiosity to learn about integrating FPGA solutions with MCU platforms
- Good problem-solving skills and attention to detail
- Eagerness to collaborate and grow in a hands-on engineering environment
- Experience or coursework with I2C, SPI, UART, USB, I2S, or MIPI interfaces
- Exposure to low-power hardware, signal processing, or wearable systems
- Contributions to hardware projects, open-source designs, or FPGA demos
What We Do
Ixana is a Purdue University spinoff and fabless semiconductor company pioneering brain-inspired wearable computing. The company develops Wi-R, a patented E-field wireless technology that provides ultra-low power, high-bandwidth connectivity for wearables, AR/VR, robotics, and industrial applications. Ixana's mission is to enable always-on, low-latency edge AI and high-speed human-computer interfaces by breaking the energy-latency trade-off through confined E-field coupling.
