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Leads complex analog/mixed-signal semiconductor programs from specification through tape-out and silicon validation. Responsibilities include developing schedules, managing milestones, budgets, dependencies, risks, and deliverables; coordinating circuit design, layout, verification, validation, systems, operations, foundries, and vendors; leading program reviews; communicating status and trade-offs; and improving program management processes.

Leads mechanical architecture and system integration for rack-scale AI infrastructure, GPU platforms, networking systems, optical connectivity, and air- or liquid-cooled systems. Defines rack layouts, mechanical interfaces, packaging, cable management, cooling integration, manufacturability, serviceability, and design requirements. Collaborates with electrical, thermal, power, silicon, software, manufacturing, product, and ODM teams to drive system integration, validation, cost optimization, and production readiness.

Own immigration case management end-to-end, manage external immigration service providers, and lead cross-functional HR operations projects. Build and document SOPs, dashboards, and automated workflows using Microsoft tools. Partner with HR, Legal, Talent Acquisition, IT, and Finance to ensure compliant, scalable processes and strong stakeholder communication.

Lead the go-to-market strategy for fabric switch and memory controller solutions, focusing on product positioning and market intelligence while collaborating with cross-functional teams and mentoring a marketing team.

Lead SI/PI planning, design, simulation, and lab validation for high-speed connectivity products. Perform EM and PI simulations, hardware constraint definition, debug root-cause issues, and collaborate cross-functionally to deliver PCIe/Ethernet/SERDES channel solutions.

Partner with R&D business unit leadership to manage annual budgets, quarterly forecasts, and performance analysis. Develop financial models, interpret results versus budget, assess risks, and provide strategic recommendations. Collaborate with Corporate Finance and support business analysis and process improvements.

The Product Quality Engineer will perform failure analysis, drive root-cause identification, collaborate with teams, and utilize lab instrumentation to ensure high-quality AI connectivity solutions.

Design and architect high-speed analog and mixed-signal circuits (PLLs, LDOs, SerDes, ADC/DAC, references) in advanced FinFET nodes. Lead silicon bring-up, characterization, and validation; define test plans; set analog methodology and best practices; collaborate cross-functionally and mentor junior engineers through full-chip delivery.

Lead global pricing and monetization strategy for semiconductor, software, and connectivity products. Build pricing governance, policies, approval workflows, and pricing models. Partner cross-functionally with Product, Finance, Sales, and Executive Leadership, engage in senior customer negotiations, develop pricing metrics and reporting, and scale a pricing function to support profitable growth and competitive positioning.

Lead advanced FCBGA package development from concept through NPI, qualification, and high-volume manufacturing. Manage substrate suppliers and OSAT partners while overseeing schedules, quality, yield, manufacturing readiness, reliability qualification, warpage improvement, and customer quality issues. Drive root cause and failure analysis, corrective actions, and cross-functional execution. Contribute expertise in advanced packaging, including Co-Packaged Optics and Near-Packaged Optics.