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Develops, supports, and optimizes semiconductor manufacturing processes for high-volume production. Responsibilities include supporting new product introduction, creating manufacturing decision-support tools and standards, resolving process deviations, analyzing factory metrics, improving output and quality, maintaining manufacturing documentation, and partnering with factory operations, engineering, and automation teams to implement manufacturing system solutions.

Leads the architecture, development, integration, and deployment of automation software for semiconductor manufacturing. Integrates equipment control, MES, yield management, and SPC systems across wafer preparation, die preparation, and assembly test operations. Partners with manufacturing and engineering teams, debugs complex system issues, improves software scalability, analyzes yield and process health, mentors engineers, and drives automation best practices and roadmap improvements.

Installs, maintains, and supports semiconductor design and compute environments, including EDA tools, automation scripts, design flows, licenses, PDKs, and compute capacity. Resolves tool and methodology issues through tapeout, supports design ramp-up with training and documentation, collaborates with EDA providers and engineering teams, and integrates new tools and methods into scalable workflows.

Lead installation and qualification of semiconductor manufacturing tools in Intel fabrication facilities. Manage equipment hookups, installation specifications, contractors, suppliers, documentation, safety compliance, troubleshooting, data analysis, and controlled experiments. Validate tool performance against critical dimension, defectivity, and process integrity targets, coordinate configuration changes, support fabrication ramp schedules, and drive improvements in equipment reliability and operational efficiency.

Installs, maintains, and supports semiconductor design environments, EDA tools, Intel PDKs, licenses, automation scripts, design flows, and compute infrastructure. Resolves methodology and tool issues through tapeout, supports design ramp-up with training and documentation, coordinates with EDA providers and internal design teams, provisions compute capacity, and integrates new tools and methods into scalable workflows.

Lead advanced semiconductor metrology module development across packaging programs, including roadmap planning, process and equipment qualification, recipe development, SPC, sampling strategies, fab support, and excursion resolution. Partner with suppliers and cross-functional teams to develop measurement capabilities, improve manufacturing performance, and implement AI-driven monitoring and predictive process control. Own metrology readiness from initial tool installation through process sign-off and support future technology pathfinding.

Develop and execute verification plans and scalable UVM/SystemVerilog testbenches to validate CPU logic against architecture. Run system-level simulations, debug pre-silicon issues, collaborate with architects and RTL designers, maintain verification infrastructure, and document strategies while contributing to microarchitecture feature definition.

Develops semiconductor process technologies by designing, executing, and analyzing experiments; integrating process steps for complex microprocessors; developing intellectual property; ramping technologies to manufacturing volumes; and transferring processes to manufacturing teams. The role requires hands-on experimental research and collaboration across engineering and manufacturing functions.

Designs and develops custom digital CPU circuits, including memories and caches. Performs floorplanning, schematic entry, simulation, verification, and optimization for power, performance, area, timing, leakage, robustness, and yield. Develops DFT models, memory test tools, and automated design flows. Collaborates with architecture, layout, and cross-functional teams to resolve CPU design issues and characterize memory instances and compilers.

Design and enable advanced semiconductor packaging processes, perform feasibility studies and simulations, optimize materials and equipment, apply SPC, data analytics and ML to improve yield and stability, collaborate with suppliers and cross-functional teams to scale technologies for high-volume manufacturing.