Join the Wafer Assembly Technology Development Group (WATD)
As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
Key Responsibilities
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
- Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
- Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Partner with cross-functional teams to ensure process integration and alignment with project deliverables.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
- OR PhD in the same fields with 2+ years of experience.
Experience listed above should be a combination of the following:
- Development methodologies, statistical process control, and/or data analytics.
- Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
- Demonstrated expertise in leading programs from early strategy formation through high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Materials Science, Mechanical, Chemical, Electrical Engineering, Chemistry, Physics, or related STEM plus 6+ years experience OR Master's with 4+ years OR PhD with 2+ years
- Experience with development methodologies, statistical process control, and/or data analytics
- Experience in wafer-level assembly, semiconductor equipment development/processing, or advanced packaging technology development
- On-site work in Hillsboro, Oregon (ability to work on-site)
- Experience with wafer-level assembly materials such as epoxy or mold materials
- Experience leading programs from early strategy through high-volume production
- Experience with hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections
- Demonstrated technical leadership and cross-functional collaboration (yield, operations, supplier management)
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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