Top Tech Jobs & Startup Jobs

Develop and support software automation solutions for Intel Foundry customers. Responsibilities include building generative AI and agentic solutions, converting manual processes into automated CI/CD workflows, managing software infrastructure, developing test automation, and owning source control, build, packaging, release, and acceptance pipelines. The role collaborates with enablement, automation, and program management teams while operating within enterprise governance and infrastructure constraints.

Supports semiconductor backend interconnect and advanced packaging manufacturing by sustaining process health, reducing defects, and improving yield, quality, reliability, cost, and manufacturability. Designs experiments, analyzes process and yield data, monitors defectivity and parametric performance, investigates excursions, identifies root causes, implements corrective actions, manages technology changes, and supports new product transfers into high-volume manufacturing.

Develops and improves factory operational strategies, standards, processes, and systems for semiconductor production. Optimizes WIP, cycle time, output, capacity, and manufacturing velocity using factory physics, Theory of Constraints, Lean principles, and data analytics. Leads cross-functional initiatives, resolves systemic constraints, governs operational systems, implements KPIs and decision-support tools, drives best-known methods across virtual factory networks, and provides technical leadership and mentorship.

Leads process integration, yield improvement, and defect reduction for Intel’s advanced packaging manufacturing operations. The role supports technology transfer, manufacturing ramp, and sustainment while collaborating with engineering and factory teams. Responsibilities include analyzing defectivity and parametric data, applying statistical process control and DOE, identifying yield limiters, improving quality and reliability, developing monitoring dashboards, and leading cross-functional technical initiatives in a high-volume semiconductor environment.

Develop TEM metrology data generation and analysis for semiconductor process development, manufacturing process control, and yield improvement. Collect and analyze dimensional data, develop automated metrology software and data pipelines, process images, apply statistical analysis, and investigate reliability risks. Collaborate with tool operators, technicians, data engineers, and manufacturing process teams to improve automation, identify trends, and support engineering decisions.

Lead reliability assessment and qualification of silicon photonic devices and PICs. Design and execute DOEs, develop reliability models, root-cause failures, create characterization and acceleration methods, support process certification and HVM transitions, and collaborate cross-functionally to drive quality and manufacturability.

Lead yield and failure analysis to identify root causes and implement solutions. Use advanced statistical methods, machine learning, and data mining on high-volume manufacturing data. Drive continuous improvement, quality programs, technology transfer, and process qualification. Collaborate cross-functionally to resolve complex process and reliability issues and develop tools and algorithms to improve manufacturing yield and performance.

Develop CPU architecture specifications, innovate designs for various computing segments, collaborate across teams, and debug microarchitectural issues.

Design, develop, debug, validate, and maintain development tools, flows, SDKs, IDEs, debuggers, and automation for build, deployment, testing, and performance optimization. Collaborate with cross-functional teams to capture requirements, deliver high-quality software solutions, and provide technical guidance.

Lead process and equipment development for die-to-wafer hybrid bonding and advanced packaging. Optimize materials, alignment, overlay, contamination control, and yield through DOE, characterization, modeling, and vendor collaboration. Drive FOK platform development, transfer to manufacturing, and continuous improvement to improve module performance, reliability, and throughput.