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Lead complex development projects, manage resources and timelines, drive product qualification and fulfillment, and oversee project progress and reporting.

The role involves deep characterization testing of HBM cubes, focusing on thermal, mechanical, and electrical domains to improve power, performance, and reliability. Responsibilities include creating test setups, analyzing data, identifying failure modes, and collaborating with various engineering teams.

Design and develop 3D-NAND memory array drivers and circuits; conduct simulations, collaborate on debugging, and implement design automation tools while mentoring junior engineers.

The role involves operating and maintaining thin film deposition equipment, performing preventive maintenance, collaborating on process improvements, and adhering to safety protocols.

The Equipment Engineer is responsible for maintaining equipment functionality, performance analysis, collaborating with teams, addressing issues, and driving cost reduction activities while ensuring safety and quality standards are met.

The Principal Engineer will implement and debug ASIC prototyping flows, support SSD ASIC development, and automate validation processes while collaborating with teams.

Design and implement digital circuits for memory products, collaborating with global teams on layout and optimization, managing physical design processes, and contributing to innovation.

The Equipment Engineer will optimize photolithography processes for semiconductor fabrication, lead process improvements, troubleshoot equipment issues, and collaborate with teams for effective integration. Responsibilities include performance evaluation, conducting research for process adjustments, and ensuring compliance with specifications.

Design and verify analog and mixed signal integrated circuits for memory interfaces, drive complex layouts, and perform silicon characterization and testing.

As a Principal Engineer, you'll lead shaping semiconductor packaging technologies, driving innovation, mentoring teams, and solving complex assembly process problems.