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Develop and optimize photolithography processes for advanced 3D DRAM using 365 nm, 248 nm, and 193 nm immersion lithography. Lead module process development, reduce variability and cost, perform root-cause analysis, maintain a pilot manufacturing line, collaborate with integration teams and vendors, and support process transfer to production.

Leads Micron’s global DRAM packaging organization, defining long-term technology strategy and delivering advanced packaging solutions including HBM, 3D integration, heterogeneous integration, and chiplets. The role oversees cross-functional product development through high-volume manufacturing, drives technology investments, develops customer and supplier partnerships, and leads digital transformation using AI, analytics, automation, and engineering productivity initiatives. It also requires building high-performing global teams and influencing business and technology direction.

Develops and prepares semiconductor device layouts and detailed drawings from engineering schematics. Leads major block development, product revisions, floor-planning, signal-planning, and power-planning. Verifies layout data integrity, performs physical verification and root-cause debugging, assigns resources, schedules tasks, and collaborates globally with design, verification, technology development, and CAD teams. Improves layout efficiency through automation, new methodologies, and quality optimization.

Lead semiconductor metrology and process engineering for DRAM manufacturing. Responsibilities include process startup, qualification, optimization, yield improvement, cost reduction, failure analysis, supplier management, audits, equipment and material evaluations, and new product introduction. The role requires operating and analyzing KLA, ASML, Hitachi, and Applied Materials metrology tools, performing photolithography metrology analysis, and using JMP for statistical process control, gauge capability, critical dimension analysis, and designed experiments.

Support next-generation DRAM product development through electrical characterization, test development, circuit analysis, design validation, yield analysis, and failure investigation. Collaborate with process, design, manufacturing, and test engineering teams to resolve product issues. Develop automation scripts, data analysis tools, and improved test methodologies while applying statistical analysis and AI-enabled technologies to enhance product quality and testing efficiency.

Develop, test, debug, and optimize SSD firmware alongside experienced engineers. Responsibilities include creating test plans, supporting product qualification, participating in code reviews, improving software quality, and using AI-enabled tools to automate engineering workflows. The role provides hands-on experience with embedded systems, firmware development, debugging, storage technologies, and reliability improvements for next-generation data center products.

Supports verification of High Bandwidth Memory designs by developing simulation test plans, analyzing specifications, creating verification strategies, debugging issues, and maintaining hardware verification environments. Collaborates with global engineering teams on semiconductor products for AI, machine learning, and high-performance computing applications while gaining hands-on experience in design verification and advanced memory technologies.

Develops internal and executive communications for Micron’s High Bandwidth Memory organization. Translates complex technical, product, program, and business information into engaging content for diverse audiences. Creates presentations, newsletters, intranet updates, announcements, communication plans, editorial calendars, and messaging strategies. Partners with leaders and cross-functional teams to support organizational change, maintain message consistency, measure engagement, and ensure accuracy, confidentiality, and brand alignment.

As a Pathfinding Device Integration Engineer, you will evaluate novel device concepts, manage process integration, and optimize device performance through experiments and analysis.

Develop, test, debug, and improve SSD firmware alongside experienced engineers. Responsibilities include implementing firmware features, resolving performance and reliability issues, creating test plans, supporting product qualification, participating in code reviews, improving development processes, and documenting technical information.