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Supports verification of High Bandwidth Memory designs by developing simulation test plans, analyzing specifications, creating verification strategies, debugging issues, and maintaining hardware verification environments. Collaborates with global engineering teams on semiconductor products for AI, machine learning, and high-performance computing applications while gaining hands-on experience in design verification and advanced memory technologies.

Develop, test, debug, and improve SSD firmware alongside experienced engineers. Responsibilities include implementing firmware features, resolving performance and reliability issues, creating test plans, supporting product qualification, participating in code reviews, improving development processes, and documenting technical information.

Supports new product introduction planning from early development through production ramp. Coordinates supply chain, procurement, manufacturing, engineering, and business stakeholders to create production plans, validate demand and master data, monitor sampling requirements, and ensure capacity and material readiness. Uses SAP ERP and enterprise planning systems to generate weekly build plans, identify supply shortages and capacity constraints, and resolve supply gaps.

The manager will lead the NVMQRA team, ensuring product quality and reliability of non-volatile memory products through testing, collaboration, and continuous improvement.

Supports high-volume semiconductor manufacturing by monitoring, maintaining, troubleshooting, and upgrading equipment. Partners with equipment owners and process teams to resolve yield loss, defects, excursions, and output loss. Drives root-cause analysis, preventative maintenance, equipment availability, TPM, SPC, DOE, and 8D problem solving. The role requires hands-on work with electrical, mechanical, vacuum, gas-flow, and software systems in a cleanroom on rotating 12-hour shifts.

Defines next-generation HBM PHY and analog/mixed-signal I/O architectures for high-bandwidth memory products. Responsibilities include transmit and receive path design, clocking, signaling, equalization, timing budgets, analog calibration, adaptive tuning, and silicon learning methodologies. The role leads cross-functional architectural decisions, evaluates performance, power, area, reliability, and manufacturability tradeoffs, drives roadmap innovation, develops engineering standards, and mentors design teams through concept-to-silicon execution.

Supports silicon bring-up, testing, and validation of new ASIC devices. Uses laboratory equipment, automation tools, and validation environments to characterize functionality and performance. Develops scripts and AI-assisted workflows, analyzes results, debugs issues, evaluates AI-generated insights, documents findings, and presents recommendations. Collaborates with validation, design verification, and firmware engineering teams while contributing to validation infrastructure and next-generation semiconductor product development.

Lead system-level signal and power integrity engineering for next-generation HBM products. Responsibilities include channel analysis for 2.5D and 3D interposers, power delivery architecture, electromagnetic modeling across PCB, package, and interposer designs, and establishing SI/PI standards and sign-off criteria. The role provides technical direction across complex designs and requires expertise in electromagnetics, transmission lines, I/O design, EDA tools, and automation scripting.

Lead the architecture and delivery of production AI, machine learning, data science, and agentic AI systems for semiconductor engineering. Design end-to-end pipelines, develop and evaluate models, deploy inference services, establish monitoring and guardrails, and guide technical roadmaps. Apply prediction, diagnosis, optimization, retrieval, and workflow automation to engineering challenges while mentoring engineers and communicating progress, risks, and model limitations to technical and executive stakeholders.

Develop, optimize, and sustain semiconductor fabrication processes to improve yield, quality, cost, and productivity. Use SPC/FDC/APC and data analytics to investigate defects, lead process changes, qualify technologies, manage process control plans, and collaborate across manufacturing, quality, and equipment teams.