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Act as Micron's technical advisor for datacenter customers to drive DRAM/HBM/SSD design wins, resolve system configuration and performance issues, guide memory architecture and optimization, support validation/lab testing and deployments, and collaborate across sales, product, and engineering teams.

Lead strategy, roadmap, and lifecycle management for a global DRAM product portfolio serving cloud, AI, enterprise, and PC markets. Drive cross-functional product delivery via PLM, engage customers and partners to shape requirements and positioning, and manage and develop a global product management team while reporting to executive leadership.

Design and analyze digital and analog circuits for HBM/DRAM products, including simulation, optimization, floorplanning, timing/area/power trade-offs, full-chip and block-level functional evaluation, architecture pathfinding, and collaborating on memory, logic, and analog circuit development. Leverage AI for research and design tasks.

As a Staff HBM Design Architect at Micron, you will define and implement DFT architectures for HBM products, ensuring quality and yield through collaboration across various teams and handling silicon directly.

Maintain and operate semiconductor processing equipment, conduct data analysis, support process improvements, and perform preventative maintenance in a cleanroom environment.

Lead and govern Risk-Based Process Safety for high-complexity memory manufacturing. Partner with engineering and manufacturing to assess and mitigate process risks, support Management of Change, facilitate hazard analyses and investigations, and provide guidance and reporting on safety trends and program health across global sites.

Lead thin films process development for advanced DRAM: diagnose and resolve process issues, drive yield/cost/productivity improvements, validate and scale new processes/tools/materials, manage supplier quality and audits, and support product ramps.

Develop and optimize dry etch processes for next-generation DRAM, collaborate with integration and process teams, perform root cause and defect analysis, apply statistical methods to improve process capability and manufacturing readiness, and support process transfer and production issue resolution.

Lead development, optimization, and transfer of advanced DRAM wet processes (cleans, etch, plating). Drive technology roadmaps, troubleshoot via root-cause analysis, collaborate cross-functionally and with vendors, and influence strategic process and tooling decisions to enable high-volume manufacturing.

Lead development, startup, and optimization of CMP processes for advanced packaging. Drive yield, cost, and productivity improvements, perform failure analysis and process control, manage complex cross-functional projects, collaborate with vendors, and apply AI/data methods to enhance workflows and manufacturability.