Principal HBM Architecture & Circuit Design Engineer

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
HBM Core-Die Architecture & Circuit Design Engineer
This role owns next-generation HBM core-die architecture and critical DRAM circuit design that directly impact bandwidth, power, area, thermal efficiency, and long-term reliability. The engineer will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D-stacked HBM products. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Key Responsibilities

• Own HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability features

• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths

• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs

• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes

• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis

• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology

• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution

• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent)

• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms

• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent)

• Ability to evaluate performance, power, area, thermal, and reliability trade-offs

• Experience driving architecture decisions and cross-functional technical execution

• Strong problem-solving and communication skills

The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$150,000.00 - $308,000.00 a year
Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
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