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The Process Integration Engineer will develop advanced DRAM technologies, lead troubleshooting, drive yield improvement, and mentor others within the BEOL team while ensuring technology transfers for high-volume manufacturing.

Contribute to DRAM process integration R&D by defining design rules and specs, collaborating across device, materials, and process teams, documenting integration plans and risks, evaluating architectures and scaling approaches, and using AI/AI-assisted tools and statistical methods to support technology development.

Develops firmware verification plans for enterprise SSD customer requirements and NVMe features. Builds and enhances Python-based test automation, reporting, and data-collection tools; executes validation and regression testing; analyzes failures and performs root-cause investigations. The role also applies machine learning, LLMs, and agent-based AI solutions to improve test development, workflow automation, failure analysis, and validation efficiency.

Serve as a technical lead and trusted advisor to automotive and embedded customers, providing memory architecture guidance, product recommendations, technical training, and hands-on support. Travel to customer sites to identify opportunities, troubleshoot critical issues, coordinate cross-functional teams, validate solutions, and collaborate with sales, marketing, and development to deliver and track customer-focused memory solutions.

As Principal Design Verification Quality Engineer, you will lead DRAM verification quality strategies, manage verification systems, and drive AI-driven verification processes while collaborating with design teams to enhance quality and efficiency.

Own physical implementation and top-level integration of large digital/NAND designs: drive partitioning, floorplanning, place-and-route, timing/DRC/LVS/EM-IR closure, and block assembly. Perform APR and STA sign-off, parasitic modeling, constraint/SDC authoring, automation (Tcl/Python/Perl), and collaborate across CAD, STA, DFT, and product teams to ensure manufacturability and successful tapeouts.

Leads global semiconductor contamination control strategies across manufacturing sites. Develops monitoring and prevention programs for particles, airborne molecular contamination, metals, humidity, and temperature. Partners with engineering and manufacturing teams to resolve yield, reliability, and quality issues; standardizes metrics and procedures; supports wafer transfers, shipment processes, and capacity expansion. Manages cross-functional projects and applies AI, analytics, and automation to improve process monitoring and operational effectiveness.

Verify and optimize digital and analog DRAM circuit designs through planning, simulation, coverage closure, debug, silicon validation, and tape-out support. Collaborate with engineering, manufacturing, and product teams to deliver reliable, manufacturable memory products meeting performance, cost, compliance, and customer requirements.

Manage a strategic global AI platform account for Micron, developing growth strategies across embedded, robotics, automotive, client, and consumer markets. Build executive and technical customer relationships, manage multi-product pipelines and forecasts, and coordinate with product, engineering, operations, supply chain, finance, legal, and pricing teams. Provide market intelligence and translate technical requirements into business strategies that drive revenue, design wins, qualifications, and account growth.

Partners with HBM and Richardson site leaders to translate business priorities into people strategies, workforce plans, and talent actions. Advises leaders and employees on HR policies, organizational effectiveness, performance, change management, engagement, and development. Uses workforce data, employee insights, and AI to identify organizational trends and risks. Coordinates with HR centers of excellence and supports onboarding, retention, culture initiatives, communications, employee resource groups, and site growth.