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Reposted 25 Days AgoSaved
In-Office
San Jose, CA, USA
209K-250K Annually
Expert/Leader
209K-250K Annually
Expert/Leader
Big Data • Information Technology
The Principal Physical Design Engineer will oversee end-to-end STA ownership, coordinating and executing design processes for connectivity ASICs while ensuring robust timing closure and collaboration with various engineering teams.
Top Skills: CadenceCxlEthernetNvlinkPciePerlPythonSynopsysTclUalink
Reposted 25 Days AgoSaved
In-Office
San Jose, CA, USA
158K-230K Annually
Senior level
158K-230K Annually
Senior level
Big Data • Information Technology
Drive customer success for Taurus Ethernet solutions through technical engagement, debugging complex issues, and collaborating with internal teams for product evolution.
Top Skills: Ber Test ToolsCosmosCxlEthernetNvlinkOscilloscopesPcieProtocol AnalyzersPythonTclUalink
Reposted 26 Days AgoSaved
In-Office
San Jose, CA, USA
175K-230K Annually
Senior level
175K-230K Annually
Senior level
Big Data • Information Technology
Lead the development of AI-powered IP Lifecycle and Quality Assurance Platform, ensuring all IP meets integration standards, through advanced EDA tools and automated audits.
Top Skills: CalibreCxlEthernetFusion CompilerGenusIc CompilerInnovusLiberateNvlinkPciePrimesimPrimetimePythonSpyglassSystemverilogTclTessentUalink
27 Days AgoSaved
In-Office
Singapore, SGP
Internship
Internship
Big Data • Information Technology
Support layout design of analog and mixed-signal blocks, perform LVS/DRC/PEX verification, assist floorplanning, placement, routing and matching, optimize layouts with circuit designers for performance and manufacturability, and document work for reviews and tape-out under mentorship.
Top Skills: Cadence VirtuosoCmosDrcFinfetGitLvsMentor GraphicsPerforcePexSynopsys
27 Days AgoSaved
In-Office
Singapore, SGP
Senior level
Senior level
Big Data • Information Technology
Lead block- and top-level physical implementation for high-speed transceiver IPs: floorplanning, placement, CTS, routing, routing signoff, EM/IR and congestion analysis, timing closure, IP integration, ECO/tapeout support, and automation scripting to optimize area, power, and timing in advanced process nodes.
Top Skills: Cadence InnovusCalibreChipletCosmosCxlEthernetNvlinkPciePerlPhyPythonRedhawkSerdesSocSynopsys Icc2TclTsmc 3NmUalinkVoltus
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Reposted 27 Days AgoSaved
In-Office
San Jose, CA, USA
185K-230K Annually
Expert/Leader
185K-230K Annually
Expert/Leader
Big Data • Information Technology
The Principal Digital Design Engineer will architect and implement advanced digital designs for AI connectivity, manage complex design blocks, and drive RTL implementations, ensuring production-quality silicon for high-speed protocols.
Top Skills: CadenceCxlEthernetNvlinkPcieSynopsysUalink
28 Days AgoSaved
In-Office
San Jose, CA, USA
133K-185K Annually
Senior level
133K-185K Annually
Senior level
Big Data • Information Technology
Lead RTL design and implementation for connectivity silicon blocks from microarchitecture through synthesis sign-off. Collaborate with architecture, verification, DFT, and physical design teams to achieve timing closure, CDC, lint, and low-power goals. Mentor engineers, debug pre- and post-silicon issues, and drive methodology for timely tapeouts.
Top Skills: Assertion-Based VerificationBistCdcCxlDftEmulationEthernet MacEthernet PcsFloorplanningFormal VerificationLintLow-Power DesignPciePhysical DesignRtlScanSynthesisSystemverilogTiming ClosureUalinkUcieVerilog
28 Days AgoSaved
In-Office
San Jose, CA, USA
205K-255K Annually
Senior level
205K-255K Annually
Senior level
Big Data • Information Technology
Lead advanced packaging R&D for photonics products, defining process flows (wafer/panel/die), integrating EIC-to-PIC, qualifying materials and equipment, partnering with OSATs and vendors, and driving yield, reliability, PDKs, and packaging design rules for NPO/CPO products.
Top Skills: 2.1D2.5D3D IntegrationAdhesivesCosmosCpkCu PillarCxlDie-Level PackagingDielectricsEicEthernetFlip-ChipHybrid BondingMolding CompoundsNvlinkOptical-Grade EncapsulantsOsatOvermoldPanel-Level PackagingPciePdk DevelopmentPicRdlSilicon PhotonicsSpcTsvUalinkUnderfillWafer-Level Packaging
28 Days AgoSaved
In-Office
Bengaluru, Bengaluru Urban, Karnataka, IND
Senior level
Senior level
Big Data • Information Technology
Lead formal verification for complex IP and SoC designs: create formal plans, develop assertions and properties, drive proof convergence, deploy verification flows and tools, mentor engineers, triage bugs, and support verification sign-off to ensure first-pass silicon success.
Top Skills: Assertion-Based VerificationFormal VerificationJaspergold (Jg)PerlPythonShellSvaSystemverilogTclVc Formal (Vcf)
Reposted 28 Days AgoSaved
In-Office
San Jose, CA, USA
230K-265K Annually
Expert/Leader
230K-265K Annually
Expert/Leader
Big Data • Information Technology
Lead DFT strategy and execution for multi-die PCIe switch products using 2.5D/3D packaging. Define test architecture, implement scan/ATPG/MBIST/LBIST, drive fault coverage targets, optimize production test and ATE costs, collaborate across design, packaging, validation, and manufacturing to ensure yield, reliability, and production ramp.
Top Skills: 2.5D Packaging3D IntegrationAdvantest AteAibBowChiplet ArchitecturesCowosCxlDftmaxEmibEthernetHbmHigh-Speed Serdes BistHybrid BondingIeee 1149.1 (Jtag)Ieee 1687 (Ijtag)Ieee 1838 (3D-Dft)Jesd229Jesd235Kgd StrategiesLbistMbistMentor TessentMicro-BumpNvlinkPcie (Gen3/4/5/6)Synopsys Dft CompilerTeradyne AteTetramaxTsvUalinkUcie
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