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Lead global development of high-power modules from definition through volume manufacturing for automotive, industrial and AI markets. Drive module architecture, materials, thermal and electromechanical simulation, DFMEA, DOE, cost optimization, supplier/CM collaboration, qualification (JEDEC/AEC-Q100), failure analysis, and ramp-to-volume with manufacturing alignment.

Support new product introductions and sustaining activities for analog/mixed-signal semiconductor products. Drive yield and cost-reduction efforts, develop and maintain low-level ATE test code, analyze automated test data and RMAs, and coordinate with fab, assembly, test, design, and quality teams to resolve failures and improve manufacturing/test processes.

The Process Integration Engineer develops silicon process technology for integrated devices, optimizing processes and facilitating technology transfers while ensuring manufacturability and reliability.

Lead product-level engineering for SiC JFET, driving development coordination, governance, and qualification with cross-functional global teams to meet performance and schedule targets.

The Applications Engineer Director will lead a team in evaluating and validating SiC technologies while collaborating with customers and product management to influence product development and roadmaps.

Manage and support Oracle Fusion HCM and payroll systems for Korea: administer HR systems, ensure payroll accuracy and compliance, support integrations (LMS, timekeeping, ERP), produce payroll and HR reports, train HR users, and collaborate with IT, Finance, and vendors for system improvements.

Support NPI and sustaining activities for analog/mixed-signal semiconductor product lines: drive cost reduction and yield improvements, own customer RMA root-cause analysis, create automated data-analysis reports, develop/modify low-level ATE code, interface with FAB, assembly, test and cross-functional teams, and document lessons learned for process and test optimization.