New Product Development Technical Lead - JFET

The successful candidate will combine strong technical understanding with execution leadership and communication skills to act as the product‑level engineering owner, ensuring alignment between technical execution and business objectives. This individual will collaborate with global NPD teams and cross‑functional organizations to define, prioritize, and drive product‑level engineering activities to achieve performance, reliability, cost, and schedule targets. 

1. Product‑Level Engineering Ownership 

• Own product definitions and requirements for SiC JFET die, discrete, and power module products. 

• Translate business, system, and customer requirements into clear, actionable product‑level engineering deliverables. 

• Ensure consistency of product intent across die → discrete → module implementations. 

• Track and manage product‑level tradeoffs among performance, reliability, cost, and schedule. 

2. Cross‑Functional Development Coordination 

• Act as the primary integration and alignment point between TD, PE, packaging, test, reliability, quality, and manufacturing teams. 

• Drive alignment on interfaces, dependencies, deliverables, and milestones across organizations. 

• Identify execution gaps, conflicts, and risks early, and facilitate resolution through the appropriate technical owners. 

• Ensure timely technical decisions are made by the correct design authorities, without directly owning die or package design decisions. 

3. Execution Governance & Risk Management 

• Own and maintain product‑level risk registers covering design, reliability, qualification, and manufacturing risks. 

• Drive mitigation plans and monitor execution status across functions. 

• Lead product design reviews, qualification readiness reviews, and key execution checkpoints. 

• Ensure adherence to NPD gate requirements and established engineering governance processes. 

4. Problem Solving, Escalation Management & Task‑Force Leadership 

• Act as the product‑level owner for complex technical and execution issues, driving structured problem solving across TD, PE, packaging, test, reliability, and manufacturing teams. 

• Lead cross‑functional task‑force teams to address critical product risks, qualification failures, reliability issues, and schedule threats. 

• Drive root‑cause analysis at the product level, ensuring issues are well‑framed, owned by the appropriate experts, and closed with effective corrective actions. 

• Manage product escalations by clearly defining problem statements, risks, options, and recommended paths forward, ensuring timely resolution. 

5. Qualification & Reliability Alignment 

• Own the product‑level qualification strategy and alignment to AEC/AQG and customer requirements. 

• Coordinate with reliability, FA, and PE teams to interpret qualification results and assess product‑level impact. 

• Ensure issues are properly dispositioned with clear containment, corrective action, and documented learning. 

• Drive incorporation of lessons learned into product BKMs and future programs. 

6. Manufacturing & Release Readiness 

• Coordinate product readiness for handoff to manufacturing, including documentation, test coverage, and product specifications. 

• Ensure alignment between development intent and manufacturing capability. 

• Support yield learning, ramp readiness, and post‑release issue management from a product‑level perspective. 

7. Executive‑Level Reporting & Stakeholder Communication 

• Provide clear, concise executive‑level reporting on product status, risks, qualification readiness, and recovery plans. 

• Translate complex technical and execution challenges into decision‑ready summaries for leadership forums. 

• Own consolidation of cross‑functional inputs into aligned product‑level messaging, including timelines, dependencies, and tradeoffs. 

• Support leadership reviews, escalation forums, and program checkpoints with data‑driven recommendations and clear accountability. 

• Master’s degree in Electrical Engineering, Materials Science, or related field.  

• 10+ years of experience in power semiconductor product development (SiC preferred).  

• Solid understanding of power device behavior, packaging interactions, and reliability concepts sufficient to guide product‑level decisions.  

• Strong execution, coordination, and communication skills across global cross‑functional teams.  

• Proven ability to manage complex NPD programs and drive closure without direct design authority.