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Support new product introduction and sustaining activities for analog/mixed-signal semiconductor product lines. Drive yield and cost reduction, troubleshoot FAB/assembly/test excursions, develop/modify low-level ATE code, generate automated data analysis reports, own customer RMA root-cause analysis, and coordinate cross-functional teams to meet cost and quality benchmarks.

Support new product introduction and sustainment for analog/mixed-signal ICs: drive cost-reduction and yield improvement, develop/modify low-level ATE code, own RMA root-cause analysis, automate data analysis reporting, and coordinate cross-functional factory and design teams to meet cost and quality benchmarks.

The Staff Human Resources Business Partner provides strategic HR support, driving HR programs, managing employee relations, and partnering with leadership to align HR initiatives with business objectives.

Lead new product development for analog, mixed-signal, and digital ICs, defining DfT strategies, developing ATE test programs and hardware, owning pre- and post-silicon bring-up, validation, characterization, and driving test-cost, yield, and quality targets across product lines.

Develop and validate eFuse, Hot-Swap, and power-switch reference designs and validation infrastructure; perform system modeling and power-tree analysis; support customer design reviews, bring-up, debugging, and benchmarking; collaborate on product requirements and produce technical collateral.

This role involves leading an applications engineering team focusing on power conversion solutions, providing technical support, engaging with customers, and driving product development based on market needs.

The Ultrasonic Wire Bond Process Engineer optimizes ultrasonic wire bonding processes, drives yield improvements, manages bonding tools, and collaborates with various teams for manufacturing support.

Develop, optimize, and sustain semiconductor manufacturing processes to ensure stable production, yield, and product quality. Plan and analyze DOE and engineering runs, monitor inline data, identify root causes, and collaborate with equipment, device, and manufacturing teams to support process transfers, qualification, and production ramp-up.

Leads system architecture for solid-state transformer and high-voltage power electronics solutions. Defines requirements, interfaces, and end-to-end architectural decisions across power, controls, thermal, cost, and safety constraints. Collaborates with OEMs, Tier 1 partners, and cross-functional hardware, software, systems, product, design, and validation teams. Guides functional safety compliance, system modeling, validation, technical strategy, and engineering team development for automotive and industrial applications.

Own the business unit’s monthly forecasting, annual budgeting, financial modeling, variance analysis, and executive reporting. Partner with cross-functional and global leadership to evaluate performance drivers, support investment decisions, improve cost management, and identify margin opportunities. The role also advances finance automation, reporting scalability, and process effectiveness using AI tools and LLMs.