The Role
The Ultrasonic Wire Bond Process Engineer optimizes ultrasonic wire bonding processes, drives yield improvements, manages bonding tools, and collaborates with various teams for manufacturing support.
Summary Generated by Built In
I. Basic Purpose of the Job
•The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.
II. Reporting Relationship
•Reports directly to the FOL Process Engineering Team Lead
ResponsibilitiesIII. Major Duties and Responsibilities
ØOwn and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
ØDrive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
ØDevelop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
ØLead process characterization through DOE, window validation, and material/tooling optimizations.
ØManage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
ØSupport customer audits, IATF/ISO compliance, and change control activities.
ØCollaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Mechanical, Industrial, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
oPractical experience on Orthodyne, KnS Power Fusion / platforms
oExperience with Al wire or advanced interconnects is a plus.
oExperience in thermosonic wire bonding is an advantage
•Skills and Knowledge Requirement
•Strong understanding of:
•Ultrasonic bonding fundamentals and mechanisms
•IMC formation, bond strength, and bond durability
•Pad metallization and bondability.
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•Proficient in DOE, SPC, MSA, PFMEA, and statistical problem solving
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•Familiar with wire bond‑related reliability risks and FA tools:
•CSAM, X‑ray, SEM, bond pull/shear analysis
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•Strong written and verbal communication skills
•Capable of leading technical escalations and customer‑facing discussions
About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Skills Required
- Bachelor's degree in Engineering (Mechanical, Industrial, Electronics, or related field)
- 3 years in semiconductor manufacturing
- 2 years focused on wire bond ultrasonic wire bonding
- Practical experience on Orthodyne and K&S Power Fusion platforms
- Experience with Al wire or advanced interconnects
- Experience in thermosonic wire bonding
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
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The Company
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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