Top Tech Jobs & Startup Jobs

Leads cost and pricing analytics across business units by monitoring market trends, evaluating cost drivers, developing pricing strategies, modeling margin impacts, and recommending actions to improve revenue and profitability. Partners with Marketing, Sales, Finance, and Operations, builds dashboards and executive reports, supports negotiations and price increase programs, and establishes consistent pricing governance and reporting processes.

Processes supplier invoices, maintains payment schedules, resolves accounts payable issues, and responds to supplier inquiries. Supports month-end close through accruals, account reconciliations, account analysis, and financial reporting. Ensures AP compliance with internal controls, assists with audit documentation, and contributes to process improvement initiatives.

Own the end-to-end demand planning process, developing forecasts, analyzing market and channel inventory trends, leading revenue reviews, and identifying risks and opportunities. The role supports annual and long-range planning, price and margin analysis, forecast accuracy improvement, and executive decision-making. It requires close collaboration with Sales, Finance, Supply Chain, and business-unit leaders, along with strong analytical, communication, and cross-functional leadership skills.

Leads semiconductor package and die preparation process development, including laser ablation, mechanical dicing, and stealth dicing. Designs experiments, analyzes data, optimizes process parameters, documents processes, develops control plans, resolves complex technical issues, and integrates emerging packaging technologies. Collaborates cross-functionally, ensures compliance with industry standards, and mentors junior engineers. Requires substantial semiconductor package assembly process development experience and expertise in wafer singulation, packaging technologies, and materials.

Leads development and commercialization of advanced semiconductor packaging technologies. Responsibilities include package architecture, substrate and material selection, process development, reliability qualification, manufacturing readiness, supplier collaboration, root cause analysis, and yield, quality, and cost improvements. The role leads cross-functional teams from concept through production release and requires expertise in embedded packaging, advanced interconnects, reliability, failure analysis, statistical process optimization, and semiconductor manufacturing.

Own the equipment AI roadmap for a semiconductor fab and deploy AI/ML, advanced analytics, sensor, vision, controls, automation, and AMR solutions. Integrate equipment, MES, facilities, and manufacturing data into reusable datasets, digital twins, and data lakes. Develop maintenance knowledge assistants, predictive and diagnostic tools, and production dashboards. Lead projects from proof of concept through sustained deployment, coordinate with IT, engineering, vendors, and technicians, and mentor teams on data and AI practices.

Develop and execute thermo-mechanical simulations for semiconductor packages, power modules, and electronic assemblies. Analyze thermal performance, stress, warpage, deformation, and reliability risks using FEA. Support material and package selection, failure analysis, experimental correlation, and design optimization. Collaborate with design, process, reliability, and manufacturing teams; improve modeling methodologies, prepare technical reports, and contribute to advanced packaging and power semiconductor technology roadmaps.

Supports semiconductor metrology and factory efficiency initiatives by analyzing equipment utilization, queue times, cycle times, throughput, and manufacturing data. The intern identifies bottlenecks, participates in Lean Manufacturing and continuous improvement projects, performs statistical analysis using Minitab and Excel, supports measurement system studies and tool matching, and presents recommendations to engineering and management teams.

Summer engineering internship supporting a 300mm post-fabrication semiconductor manufacturing team. Responsibilities include collecting equipment and process data, developing process or controls improvements, evaluating materials and equipment, troubleshooting process issues, improving yield and device performance, collaborating cross-functionally, and maintaining safety and quality compliance.

Supports lithography manufacturing efficiency and continuous improvement projects by analyzing equipment and production data, developing dashboards and KPIs, investigating root causes, and assisting with photolithography process qualifications, tool matching, yield improvement, and production readiness. The intern collaborates with process, equipment, manufacturing, and industrial engineers and presents recommendations to engineering and management teams.