The Role
Leads semiconductor package and die preparation process development, including laser ablation, mechanical dicing, and stealth dicing. Designs experiments, analyzes data, optimizes process parameters, documents processes, develops control plans, resolves complex technical issues, and integrates emerging packaging technologies. Collaborates cross-functionally, ensures compliance with industry standards, and mentors junior engineers. Requires substantial semiconductor package assembly process development experience and expertise in wafer singulation, packaging technologies, and materials.
Summary Generated by Built In
- Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.
- Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
- Design and conduct experiments to develop and refine packaging processes.
- Analyze experimental data to identify trends and optimize process parameters.
- Develop comprehensive process documentation and control plans.
- Address and resolve complex process-related challenges.
- Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
- Mentor and provide technical leadership to junior engineers and team members.
- Ensure all R&D activities comply with industry standards and company policies.
- Education
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Experience
- Minimum of 8 years of experience in semiconductor package assembly process development.
- Experience in Project Management is a plus.
- Skills
- In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
- Proven track record in process development and efficient use of methodologies.
- Strong analytical and problem-solving skills.
- Excellent communication and collaboration abilities.
- Familiar with Project Management concepts and tools.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Skills Required
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- Minimum 8 years of experience in semiconductor package assembly process development
- In-depth knowledge of wafer singulation processes
- Knowledge of semiconductor packaging technologies and materials
- Proven track record in process development and effective use of process development methodologies
- Strong analytical and problem-solving skills
- Excellent communication and collaboration abilities
- Familiarity with project management concepts and tools
- Project management experience
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
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The Company
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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