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Develops and qualifies semiconductor products, focusing on IC packaging, assembly, manufacturing processes, reliability testing, production ramp-up, yield improvement, and field performance. Collaborates globally with design, test, process, manufacturing, quality, and applications teams to resolve failures, improve quality, reduce costs, and ensure reliable high-volume production of DC-DC converter products.

Maintains and improves semiconductor wirebond manufacturing equipment, including evaluating, installing, upgrading, troubleshooting, and monitoring KNS and ASM machines. Develops preventive maintenance schedules, improves equipment uptime and reliability, supports manufacturing and process engineering teams, and ensures effective documentation and safety practices. The role requires hands-on experience with wirebond equipment, semiconductor manufacturing, bonding processes, cleanroom protocols, and analytical manufacturing tools.

Provides technical application support for DDR PMICs used in data centers. Responsibilities include customer design-in support, schematic and layout reviews, board-level debugging, EVM and reference design development, bench characterization, automation, datasheet and application note creation, and new silicon evaluation. The role collaborates with systems engineers and global DRAM customers while supporting product qualification and adoption.

Leads complex semiconductor product development programs from concept through market release. Coordinates cross-functional global teams spanning design, wafer fabrication, assembly, testing, qualification, production ramp, customers, and suppliers. Manages project plans, risks, budgets, resources, schedules, logistics, quality validation, reliability testing, and failure analysis. Provides stakeholder updates, drives issue resolution, maintains development systems, and ensures products meet specifications, cost targets, quality standards, and customer milestones.

Finance internship supporting accounting, controlling, tax, and receivables teams. Responsibilities include financial reporting, forecasting, cost analysis, month-end and year-end closing, VAT returns, dashboard development, cash management, credit assessments, internal controls, and process improvement. The role offers hands-on experience in an international semiconductor company and is designed for students in business administration, finance, accounting, industrial engineering, or related fields.

Internship supporting supply chain, operations, procurement, and account pricing teams. Responsibilities may include monitoring production and service performance, coordinating order-to-delivery activities, supporting supplier setup and payment processes, executing customer pricing, and collaborating with sales, customers, and internal stakeholders. The role offers practical experience in global business processes, independent responsibilities, and cross-functional teamwork.

Develop and optimize semiconductor production test processes, fixtures, and software using automated test equipment. Troubleshoot test, quality, and device performance issues; analyze yield and test data; verify solution robustness; support multi-factory manufacturing flows; and collaborate with fabs and cross-functional teams to improve production outcomes and reduce costs.

Supports semiconductor manufacturing capacity, throughput, scheduling, and process-improvement activities. Analyzes operational data and system logs, develops reports, automates data extraction, supports capacity modeling, and performs basic coding for manufacturing applications. The intern collaborates with industrial engineering and data analytics teams in a clean-room environment to identify efficiency improvements and increase fab output.

Supports semiconductor manufacturing operations through data analysis, capacity and cost modeling, process and equipment continuous improvement, fab scheduling, dispatch optimization, factory layout planning, and capital project support. The role develops actionable insights from manufacturing data, maintains capacity model integrity, uses predictive modeling to improve performance, and collaborates across fab disciplines to drive operational execution.

Participates in a 12-month manufacturing development program supporting high-volume 300mm semiconductor wafer fabrication. Performs lot and equipment dispositions, identifies process and equipment issues, supports equipment and process startups, conducts process experiments, analyzes data, and resolves production problems to improve cycle time and manufacturing flow.