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Leads semiconductor production test strategy and ATE ecosystem development. Develops automated test processes, fixtures, and software; troubleshoots analog circuit, quality, and device performance issues; analyzes yield and production data; improves test cost, coverage, robustness, and quality; supports multi-factory manufacturing flows; and collaborates with customers, vendors, fabs, IT, and internal engineering teams.

Provides customer and product application support for DC/DC switching regulators and buck converters. Responsibilities include schematic and layout reviews, hardware debugging, evaluation board design, bench characterization and automation, silicon testing, reference design development, datasheet review, technical documentation, and customer support. Collaborates with systems engineers on new product development and supports products from definition through production ramp.

Develops and optimizes probe and final test solutions for microcontroller and DCDC converter products. Responsibilities include creating test plans and programs, designing ATE interface hardware, characterizing and debugging silicon, analyzing yield and failure data, reducing test time, supporting qualification and validation, and releasing products to volume manufacturing. The role requires collaboration with design and production teams throughout the IC product development lifecycle.

Extract and optimize compact SPICE models for advanced RF semiconductor devices, develop model formulations and AI/ML-enhanced parameter extraction methods, automate modeling infrastructure, and validate models through measurement and analysis. The engineer collaborates with circuit designers, process technologists, and cross-functional teams to support RF circuit development and design-technology co-optimization. Responsibilities also include technical leadership, project scheduling, communication, and managing multiple concurrent deliverables.

Leads architecture and transistor-level design of high-performance PMIC power converters, including buck, boost, SIMO, LDO, and charge-pump circuits. Owns the complete IC design lifecycle from specifications, schematic, simulation, layout review, and post-layout verification through silicon bring-up and characterization. Drives technical decisions, cross-functional reviews, customer alignment, design quality, and integration while mentoring junior engineers.

Design and own analog and mixed-signal PMIC blocks, including buck, boost, LDO, and charge-pump converters. Responsibilities span architecture contributions, transistor-level circuit design, schematic simulation, layout reviews, post-layout verification, silicon bring-up, and characterization. The engineer will analyze performance, reliability, noise, mismatch, and process trade-offs; collaborate across teams to resolve integration issues; make technical decisions; and mentor junior engineers.

Designs and verifies RTL for USB 2.0 and eUSB2 hubs, hosts, and bridges. Responsibilities include digital logic design, DFT, high-speed communication chip evaluation and debugging, test method development, technical documentation, and collaboration with analog and digital engineering teams. The role interfaces digital circuits with analog circuitry and supports product specifications, application materials, demo boards, and complex problem solving.

Participate in a 12-month new graduate program while owning semiconductor product engineering launch activities. Responsibilities include pre- and post-silicon development, sample buildup, silicon validation, characterization across voltage and temperature conditions, manufacturing milestone tracking, yield analysis, DOE, Gage R&R, and production test limit development for ESD, TVS, and surge protection devices.

Supports high-volume semiconductor manufacturing by selecting, installing, upgrading, maintaining, and improving CMP equipment. Analyzes equipment performance and reliability, performs lot and equipment dispositions, develops uptime and problem-resolution solutions, supports repair and process engineering teams, and defines preventive maintenance schedules. The role requires collaboration across manufacturing functions in a 300mm wafer fabrication environment, with emphasis on equipment reliability, production continuity, cycle-time reduction, and semiconductor cleanroom practices.

Develop, characterize, simulate, and optimize BiCMOS SiGeC HBT devices for RF and mm-wave volume production. Lead process and device simulations, experiments, RF/DC characterization, data analysis, and manufacturability improvements while collaborating across integration, reliability, packaging, circuit design, test, and product teams. Manage multiple technical projects, schedules, stakeholder communications, and cross-functional engineering efforts.