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The Test Engineering Intern will assist in developing isolated precision ADCs, including PCB and software development, silicon debugging, and data analysis, while collaborating with an international team.

Participate in the Career Accelerator Program, supporting financial accuracy, internal controls, cost analysis, audits, and collaborate on operational performance within TI.

Support customer operations and logistics across order-to-cash functions (sales, planning, receivables, credits, asset management). Analyze supply/demand, drive backlog coverage, improve order management, and deliver an individual project focused on automation and process efficiency during a 6–12 month internship.

Lead design and implementation of analog, digital and RF integrated circuits (including millimeter-wave), performing front-end schematic design, simulation, and post-layout extracted simulations. Collaborate on layout, wafer process integration, bench characterization, final test, failure analysis, test method definition, and firmware/calibration specifications to correlate measurements with simulations.

Lead an Analog IC design team, overseeing design from definition to manufacturing. Collaborate with various teams to ensure project success and meet customer needs.

Define product roadmaps and technical specifications for analog and digital high-speed ICs. Collaborate with stakeholders and IC development teams to take chips from concept to mass production, evaluate silicon systems, perform trade-offs, gather requirements, document lifecycle steps, and troubleshoot system-level hardware and software issues.

Provide application engineering support for RF/mmWave products: collaborate on product definition and launches, design EVMs and socket boards, perform RF lab measurements and electromagnetic simulations, troubleshoot returned silicon, and support customers through characterization to production ramp.

Define and develop embedded platform software and documentation by gathering customer and industry requirements, decomposing them into technical specifications, defining architecture, coordinating with sales, product management, and partners, and ensuring automotive industry standards and security compliance.

Drive yield and quality improvements in a 300mm analog semiconductor fab by implementing inspection recipes, managing excursion control, performing lot and equipment dispositions, analyzing data, and leading process or equipment problem resolution to increase yield, efficiency, and product quality.

Provide high-level administrative support to a senior leader: manage complex calendars, coordinate domestic and international travel, prepare presentations and reports, oversee sensitive communications and special projects, lead other administrative staff, organize meetings and events, and proactively anticipate executive needs while maintaining confidentiality.