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The Advanced Technology Development team at TI is looking for a Process Development Engineer with a long-term goal to be responsible for the development, characterization and optimization of BiCMOS SiGeC devices to meet the requirements for volume production. The ideal candidate will have a solid foundation in the theory of semiconductor CMOS or BJT process and device physics and would be comfortable driving the characterization and optimization of the device and process to insure robustness, reliability, and manufacturability meeting all electrical device performance targets.
Responsibilities include:
- Develop new processes and components to enable next generation BICMOS SiGeC technologies.
- Drive the TCAD simulation (process and device simulation, HF simulations), design of experiments, RF and DC characterization, and data analysis of key components.
- Work with multiple process, integration, reliability, packaging, circuit design and test engineers to achieve these goals.
- Work closely with the product groups to identify and optimize the BICMOS component performance to meet critical final device parameters to enable game changing products in the market.
- Work across different development groups; process flow, device design, modelling, simulation, reliability, etc.
The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.
QualificationsMinimum requirements:
- Masters degree in Electrical Engineering or Physics
- 10+ years of professional experience as a Device/PI engineer working with SiGe HBT devices.
- Strong device physics and semiconductor device engineering background
- Industry experience in developing SiGe:C HBT transistors for RF/mm-wave applications
Preferred qualifications:
- Ph.D. in EE/Physics
- Proven track record of defining, developing and delivering SiGe:C HBT components in a production flow
- Industry experience/knowledge on silicon device manufacturing from design through fabrication to test
- Industry project experience/knowledge of BICMOS device technology
- Hands-on SiGe HBT TCAD simulation experience (process and device) or high frequency simulation in 3D field solvers
- Ability to take the initiative and drive for results
- Experience with Cadence layout and circuit simulation
- Strong software skills and knowledge of software tools such as MATLAB, JMP, statistical software, etc.
- Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions and locations
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
Skills Required
- Master’s degree in Electrical Engineering or Physics
- 10+ years of professional experience as a Device or Process Integration engineer working with SiGe HBT devices
- Strong device physics and semiconductor device engineering background
- Industry experience developing SiGe:C HBT transistors for RF/mm-wave applications
- Ph.D. in Electrical Engineering or Physics
- Track record of defining, developing, and delivering SiGe:C HBT components in a production flow
- Industry knowledge of silicon device manufacturing from design through fabrication and test
- Industry experience or knowledge of BiCMOS device technology
- Hands-on SiGe HBT TCAD process and device simulation or high-frequency simulation using 3D field solvers
- Experience with Cadence layout and circuit simulation
- Strong software skills and knowledge of MATLAB, JMP, or statistical software
- Ability to take initiative and drive results
- Strong stakeholder relationship-building, verbal communication, written communication, teamwork, and collaboration skills
Texas Instruments Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Texas Instruments and has not been reviewed or approved by Texas Instruments.
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Strong & Reliable Incentives — Profit sharing and annual bonuses are portrayed as a meaningful, formula-linked upside that can materially lift total earnings in strong years. An employee stock purchase plan with a discount further reinforces recurring, wealth-building incentives.
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Retirement Support — A 401(k) match is described as a stable core benefit, with some references to additional legacy employer contributions and even pension-like elements for certain cohorts. This framing positions long-term savings support as a notable part of the overall rewards package.
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Healthcare Strength — Medical coverage is depicted as broadly comprehensive, with preventive care and access to HSA/FSA features cited as value-adds. Company-seeded HSA contributions are repeatedly characterized as an important offset to the plan design for those enrolled.
Texas Instruments Insights
What We Do
Texas Instruments develops semiconductor and computer technology for cellular handsets, digital signal processors and analog semiconductors. Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades. Learn more https://news.ti.com/index.cfm
