Top Tech Jobs & Startup Jobs

Leads quality assurance systems and activities for semiconductor manufacturing, including ISO/IATF/VDA audits, customer requirements, change management, supplier quality, NPI quality planning, risk assessment, corrective actions, and continuous improvement. Coordinates cross-functional issue resolution, verifies improvement effectiveness, conducts quality training, and supports customer and supplier audits. Requires strong quality-tool expertise, manufacturing experience, and English communication skills.

Develops, optimizes, validates, and maintains semiconductor assembly and packaging processes for stable mass production. Responsibilities include process parameter and control-plan development, DOE experiments, new material and equipment introduction, SPC/CPK data analysis, yield improvement, process issue resolution, cost optimization, and support for APQP, PPAP, VDA6.3, customer audits, and quality-system activities.

Develops and optimizes semiconductor product testing processes from new product introduction through mass production. Evaluates test programs, fixtures, test and burn-in boards, equipment, and new technologies. Performs FMEA, control planning, process validation, documentation, automation improvements, data analysis, and quality optimization. Investigates test abnormalities, identifies root causes, and drives corrective actions to improve product quality, production efficiency, capacity, cost, and delivery.

Leads GaN power device development for high-efficiency power conversion. Drives device physics, charge-trapping, reliability, architecture, characterization, data analysis, and root-cause investigations. Guides performance, yield, and reliability improvements while collaborating across multidisciplinary teams to accelerate commercialization. Requires extensive GaN semiconductor R&D experience, hands-on trap analysis, technical leadership, English and Chinese fluency, and business travel. TCAD simulation and AEC-Q101 experience are preferred.

Provides semiconductor test operations and engineering support after manufacturing release. Responsibilities include managing test operations with internal factories and outsourced suppliers, coordinating product transfers to high-volume manufacturing, expanding test capacity, deploying tester and handler technologies, troubleshooting hardware, tracking OEE and yield, improving cycle time and retest performance, and driving continuous improvement across global manufacturing sites.

Develops and validates high-voltage GaN reference designs and evaluation boards, supports customer design-ins, and optimizes power conversion systems. Provides technical support across AC-DC, PFC, LLC, DC-DC, UPS, solar, server, industrial, and EV applications. Performs product characterization, thermal and EMI optimization, root-cause analysis, customer demonstrations, training, and technical documentation while collaborating with sales, marketing, engineering, and R&D teams.

Supports demand planning, revenue forecasting, supply allocation, inventory optimization, and customer escalation management for semiconductor product lines. Partners with supply chain, sales, manufacturing, operations, product marketing, and engineering teams to align forecasts, manage backlogs, mitigate supply constraints, coordinate wafer starts, monitor inventory health, and facilitate product sampling. Performs quantitative trend analysis and maintains forecasting systems while helping achieve revenue and margin objectives.

Designs and verifies complex analog and mixed-signal circuits for custom ASICs, including CMOS, high-voltage, power management, and motor-driver applications. Responsibilities include circuit feasibility studies, AMS simulation, layout guidance, silicon debugging, lab characterization, test development, documentation, design reviews, and collaboration with DFT, test, product, and project teams.

Designs embedded middleware frameworks and device drivers for automotive ADAS, autonomous driving, gateway, and cockpit systems using Renesas SoCs. Defines software requirements, develops demonstrations, and owns software design, implementation, verification, and validation from module to system level. Requires expertise in Linux, Android, QNX, FreeRTOS, video pipelines, camera interfaces, multicore and multiprocess systems, IPC, memory management, and automotive software processes.

Designs and develops power SiP/module, wafer-level, flip-chip, and related semiconductor package technologies. Responsibilities include materials and process selection, OSAT and contract manufacturer collaboration, DOE optimization, package qualification, process integration, production controls, ramp monitoring, issue resolution, reliability qualification, package roadmap development, customer complaint resolution, and package design rule maintenance.