1. 负责半导体封装组立工序的工艺开发、优化及量产维护。
2. 制定并优化工艺流程、工艺参数及控制计划，确保产品质量和生产稳定性。
3. 负责DOE实验、工艺验证及工艺文件编制与维护。
4. 推动新材料、新设备、新工艺的评估、导入和量产应用。
5. 运用SPC、CPK等质量工具分析生产数据，持续提升良率和生产效率。
6. 主导工艺异常及品质问题分析，推动纠正预防措施落实。
7. 推进工艺改善及成本优化项目，提升制造竞争力。
8. 支持APQP、PPAP、VDA6.3、客户审核及质量体系相关活动。
Qualifications1. 本科及以上学历，微电子、材料、自动化或相关专业。
2. 3年以上半导体封装工艺相关工作经验。
3. 熟悉半导体封装工艺、设备及质量管理相关知识。
4. 熟悉DOE、SPC、FMEA、APQP、PPAP等工程与质量工具，具备工艺分析和问题解决能力。
5. 具备良好的沟通协调能力、执行力及团队合作精神。
6. 具备英文技术资料阅读及沟通能力，CET-6或具有海外学习、工作经历者优先。
Additional InformationRenesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Skills Required
- Bachelor’s degree or higher in microelectronics, materials science, automation, or a related field
- At least 3 years of experience in semiconductor packaging process engineering
- Knowledge of semiconductor packaging processes, equipment, and quality management
- Familiarity with DOE, SPC, FMEA, APQP, and PPAP tools
- Process analysis and problem-solving ability
- Strong communication, coordination, execution, and teamwork skills
- Ability to read and communicate using English technical materials
- CET-6 certification or overseas study/work experience
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.
