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Provides advanced technical support for wireless SoC and MCU customers, focusing on complex RF and hardware issues. Develops prototypes, proof-of-concept designs, automation tools, technical documentation, code examples, and knowledge-base content. Collaborates with internal development teams on requirements, testing, pre-release evaluations, bug reporting, software quality, and developer experience. Troubleshoots embedded C code, wireless systems, and customer hardware while communicating technical concepts to technical and nontechnical audiences.

Design and develop RF, analog, and mixed-signal circuits for wireless transceivers. Perform simulation, modeling, verification, laboratory data analysis, troubleshooting, and performance evaluation. Support radio development from concept through validation while collaborating with RF, analog, digital, layout, systems, validation, and product engineering teams. Document technical decisions and build expertise through mentorship and hands-on projects.

Summer 2027 internships are available across Silicon Labs’ engineering and corporate teams. Interns contribute to hands-on projects in software, firmware, testing, validation, systems, applications, finance, HR, marketing, and sustainability while receiving mentorship, professional development, and networking opportunities. Candidates must be enrolled in a relevant degree program with graduation expected December 2027 or later, and should demonstrate relevant coursework, projects, research, technical experience, analytical ability, communication skills, and a willingness to learn.

Early-career design engineering talent pool for 2027 graduates supporting analog/mixed-signal, digital, verification, physical design, RF, or design automation teams. Responsibilities may include circuit design, RTL development, verification, physical implementation, RF simulation, or engineering tool development. Candidates should have relevant technical education, coursework, research, projects, or internships and familiarity with semiconductor design tools and languages.

Summer 2027 design engineering internships for students supporting semiconductor development across analog/mixed-signal, digital design, verification, physical design, RF, and design automation. Interns may contribute to RTL development, circuit simulation, verification environments, IC layout, RF testing, or engineering tools. Candidates should be enrolled in a relevant technical degree program, graduating December 2027 or later, and have coursework, research, project, or internship experience related to semiconductor design or verification.

Talent-pool opportunity for 2027 new college graduates across software, firmware, product test, validation, applications, systems, and corporate teams. Candidates may work on embedded systems, wireless protocols, hardware and software validation, business functions, or sustainability initiatives. Applicants should have a relevant degree, academic or professional experience, strong analytical and communication skills, and willingness to learn. Specific team placement and hiring timelines depend on future business needs.

Own IoT wireless SoC products from concept through customer alpha, defining requirements, architectures, roadmaps, evaluation tools, and system KPIs. Collaborate across silicon design, software, validation, test, marketing, operations, and sales. Conduct competitive and die-level analysis, develop technology investment business cases, manage scalable product portfolios, and present product strategies to executives.

Design, implement, test, document, and maintain embedded software for Bluetooth and multiprotocol IoT products. Develop production-quality C software, write automated tests, improve build and continuous integration workflows, investigate embedded systems issues, and enhance developer tools and documentation. Collaborate within an agile team and contribute to architecture, product quality, wireless specifications, and Bluetooth SIG activities.

Supports customers developing wireless connected systems using 32-bit wireless MCUs and embedded SoCs. Creates embedded C code examples, application notes, and quick-start guides; assists with design, development, evaluation, and certification. Collaborates with IC design, software engineering, and marketing teams on product evaluations and new product definition. The role also involves embedded systems, RF modulation, PCB and SiP modules, and laboratory testing with oscilloscopes and spectrum analyzers.

Design and verify digital IC features for low-power mixed-signal SoCs, contributing across specification, microarchitecture, RTL implementation, verification, synthesis, timing, power and area optimization, and integration. The role collaborates closely with analog design, software, verification, and product teams. It is intended for motivated recent graduates or near-graduates with foundations in digital logic, computer architecture, embedded systems, and HDL-based design.