Top Tech Jobs & Startup Jobs

Supports budgeting, forecasting, long-range planning, financial modeling, capital expenditure analysis, variance reporting, and month-end close activities. Prepares financial reports, dashboards, reconciliations, inventory analyses, and business insights for Finance and Operations leadership. Partners cross-functionally to analyze manufacturing cost drivers, identify risks and opportunities, and improve reporting processes.

Leads quality engineering for optical systems and optoelectronic assemblies, including root cause investigations, CAPA, quality and control plans, audits, yield improvement, supplier quality, NPI, production ramp, and Lean Six Sigma initiatives. Partners with engineering, manufacturing, suppliers, and leadership to resolve quality issues, improve process robustness, ensure ISO compliance, and validate corrective actions in technical manufacturing environments.

Support and improve the Liquid Phase Epitaxy production process. Responsibilities include production tasks, crystal growth analysis, creating production melts, troubleshooting mechanical and electrical equipment issues, product development, and presenting technical reports. The role requires chemical handling, precision measurement, equipment-controller experience, analytical problem-solving, and cross-functional collaboration. Training at the Hillsborough, New Jersey facility is required for approximately six to eight months before working in Easton, Pennsylvania.

Lead a global commercial transactions legal team advising executive leadership on complex commercial agreements across supply, sales, manufacturing and sourcing. Drive scalable contracting processes, leverage AI tools, partner with business functions, mentor attorneys, and support global manufacturing operations with occasional international travel.

Design, test, and debug optical transceivers including electrical, optical, thermal, and timing measurements. Develop and revise PCBA, run RF simulations, create drawings/BOMs/ECOs, resolve DFM issues, support design reviews (EVT/DVT), and collaborate with cross-functional teams to ensure manufacturability and performance.

Lead development of device- and package-level test infrastructure for high-power CW lasers and related optoelectronics. Drive characterization, burn-in, yield optimization, SPC analysis, and production troubleshooting while collaborating with manufacturing and cross-functional teams and leading multidisciplinary engineering staff.

Lead planning and execution of multiple concurrent capital projects across manufacturing and facilities. Develop scopes, integrated schedules, and execution plans; coordinate engineering, facilities, contractors, and vendors; prepare capital appropriation requests; monitor progress, risks, and change control; drive stakeholder alignment and provide status reporting to site leadership while ensuring EHS and applicable ISO quality/environmental standards compliance.

Lead development engineering for chip-on-carrier and package/module assembly of high-power CW lasers and related optoelectronic devices. Work hands-on with contract manufacturers to optimize performance, yield, and integration. Collaborate cross-functionally, analyze reliability/test data using statistical methods, and perform thermal/thermomechanical modeling to troubleshoot and improve production and product quality. Ensure on-time delivery and adherence to quality and EHS standards.

Lead design, simulation, and optimization of high-speed, high-sensitivity InGaAs/InP photodiodes from concept through production. Define device architecture, partner with epitaxy and process teams, perform characterization and failure analysis, drive manufacturability and reliability, scale manufacturing, mentor junior engineers, and introduce innovative device structures and fabrication techniques.

Leads co-packaged optics and optical engine packaging from concept through production. Develops PIC/EIC co-design flows, interconnect schematics, pad frames, 3D interposer floor plans, packaging rules, materials, manufacturability, and reliability processes. Collaborates with laser packaging, silicon photonics, IC design, substrate layout, module design, and external OSAT teams. Requires deep silicon photonics and high-speed modulation expertise, cross-functional leadership, and on-site work with occasional travel.