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The Staff Digital Design Engineer develops digital subsystems for phased array and communication systems, focusing on ASIC/SoC design, RTL development, and integration across teams.

Design and develop multilayer PCB and substrate layouts (organic and ceramic), ensuring signal and power integrity, manufacturability, and documentation. Lead projects from prototype to production, perform experiments and simulations, evaluate design trade-offs, coordinate cross-functional teams, and present technical results. Maintain IPC standards and high-speed routing for interfaces like DDR, PCIe, and Ethernet.

Under minimal supervision, creates complex mechanical plans and drawings for engineering and manufacturing using CAD/CAM. Verifies dimensions, handles design computations, supports design reviews, trains junior designers, coordinates with internal departments, and ensures conformance to company quality and documentation systems.

The Sr RF/MW Engineer develops and tests RF technologies, performs device characterization, analyzes data, leads projects, and collaborates with teams for wireless chipset solutions.

Responsible for digital ASIC design architecture, project management, and implementation of verification and validation processes for mixed signals ICs.