Top Tech Jobs & Startup Jobs

Leads development of ReRAM and emerging embedded memory technologies from bitcell architecture and process integration through silicon characterization, reliability qualification, and reusable memory IP enablement. Defines technology requirements, plans DOE and test-chip activities, analyzes memory performance and failure mechanisms, develops models and design rules, supports IP release, and drives cross-functional technical reviews. Mentors engineers and communicates technical risks and tradeoffs to design, manufacturing, product, quality, and leadership teams.

Provides customer and field applications support for power management products, including converters, controllers, and drivers. Collaborates with design, quality, manufacturing, product engineering, sales, and FAEs to resolve technical issues. Supports new product development through requirements definition, application validation, customer collateral creation, product training, application notes, and bench testing.

Develop, maintain, audit, and continuously improve the Quality Management System in a semiconductor manufacturing environment. Lead CAPA and root-cause investigations, support customer and regulatory audits, analyze quality metrics, reduce defects and scrap, promote Lean and Six Sigma initiatives, update procedures, train employees, and collaborate with manufacturing, engineering, supply chain, and operations teams.

The role involves leading reliability assessments, defining reliability requirements, conducting tests, and communicating insights on power semiconductor product performance.

Drive continuous improvement of the global trade compliance program by developing policies, mapping and automating processes, identifying compliance gaps, advising business units on import and export requirements, classifying products and technology, delivering training, reporting program performance, and supporting risk assessments, audits, investigations, and remediation.

Own product quality throughout qualification, production release, and end of life for semiconductor products. Analyze manufacturing, test, failure-analysis, and customer-return data to identify root causes, manage quality risks, improve yields, and strengthen defect detection. Lead containment and global 8D investigations, facilitate structured problem solving, drive corrective and systemic actions, deploy lessons learned, and collaborate with engineering, manufacturing, operations, and customers worldwide.

Owns and maintains CFA dry etch, wet process, and thin-film equipment in a semiconductor fab. Responsibilities include preventive maintenance, troubleshooting, safety compliance, calibration, spare-parts management, equipment qualification, documentation, scheduling, technician training, reporting, and support for production, process engineering, NPI/R&D, facilities, and equipment installation projects.

Performs electrical characterization and statistical analysis of power semiconductor devices, including trench MOSFETs and IGBTs. Investigates production issues, process excursions, lot holds, reliability concerns, and electrical performance variations. Develops characterization plans, correlates wafer, package, reliability, and failure-analysis data, and supports manufacturing decisions. Collaborates with cross-functional engineering and manufacturing teams, communicates technical recommendations, and develops automated data-analysis methods to improve response times and process optimization.

Own verification of analog and mixed-signal IP within digital-on-top SoC environments. Develop UVM/SystemVerilog testbenches, behavioral analog models, verification plans, assertions, coverage, checkers, and regression flows. Debug issues across analog, digital, and mixed-signal boundaries; verify configuration, calibration, monitoring, and fault-handling interfaces; coordinate sign-off readiness; and mentor junior engineers. The role focuses on power and clock IP, including PLLs, LDOs, DC/DC converters, and oscillators.

Perform electrical, electro-thermal, and system-level simulations for next-generation power modules used in AI data centers. Model parasitic RLC, high-frequency behavior, power integrity, thermal performance, reliability, and mechanical interactions across SiC, GaN, packaging, and 3D integration. Correlate simulations with hardware measurements, develop modeling methodologies, maintain simulation environments, support customer and application teams, and advance AI-driven simulation, digital twins, probabilistic modeling, and optimization techniques.