Top Tech Jobs & Startup Jobs

Design and analyze power delivery networks for high-performance compute SoCs across package and system architectures. Perform electromagnetic, time-domain, and frequency-domain simulations; model regulators; evaluate voltage droop and overshoot; conduct lab measurements; and collaborate with hardware, layout, and systems teams to improve power integrity. Document analyses, support design reviews, monitor layout constraints, and contribute to architectural tradeoff studies.

Drive signal integrity engineering for high-speed photonics and computing products from architecture through lab validation. Analyze PCIe, UCIe, and SerDes channels using S-parameters, eye and jitter analysis, equalization, and simulation tools. Collaborate with hardware and PCB layout teams on impedance, routing, termination, and packaging. Perform measurements with oscilloscopes, VNAs, network analyzers, and TDRs, troubleshoot issues, support design reviews, and document results and guidelines.

Designs IC package substrate layouts for standard and advanced packaging technologies. Responsibilities include package floorplanning, stack-up optimization, signal and power integrity routing, DFM/DFA closure, fab-file generation, supplier and OSAT coordination, package tape-outs, and design automation. The role supports analog, digital, and photonics package architectures, including multi-chiplet and 2.5D/3D packaging solutions.

The Staff Physical Design Engineer will implement digital blocks using advanced tech nodes, focusing on timing closure and power integrity, while collaborating with teams on ASIC design.

Implement and sign off complex digital blocks from synthesis through physical verification in advanced process nodes. Drive full-chip STA and timing closure, power analysis, floorplanning, IO and clock distribution, DRC/LVS cleanup, and functional/timing ECOs. Automate flows with TCL/Python/Shell, collaborate across teams, and work with EDA vendors to resolve tool issues.

The Photonics Technical Lead will create scalable laser solutions for silicon photonics AI communications, collaborating across teams to ensure design feasibility and meet performance specifications.

Lead design verification for integrated digital, analog, and photonic devices using UVM, mixed-signal/AMS methods, RNM, and emulation. Define DV methodology, create reusable testbenches, run block and full-chip verification, integrate analog IP and behavioral models, close coverage and signoff, and collaborate with architects and designers for performance and post-silicon validation.

The Sr./Principal Mixed-Signal Digital Architect will design digital circuits for photonic-based communication, collaborate with teams, and lead product development.

The engineer will architect wafer, package, and system level characterization and test strategies for silicon photonics products, and work closely with architecture and design teams, vendors, and validation teams.

Develop high-speed analog transceiver solutions while collaborating with architects and engineers for optical communication systems.