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Design, optimize, and verify analog and mixed-signal blocks for DRAM. Leverage AI and EDA flows for circuit optimization, improve verification and yield, support post-layout simulation and silicon correlation, mentor junior designers, and independently define technical solutions.

Responsible for defining and integrating Design for Test (DFT) architectures for High Bandwidth Memory (HBM) products, ensuring robust test coverage while collaborating across multiple teams to deliver quality solutions.

The Principal Customer Integration Engineer will focus on technical engagement, product development, process engineering, and support for customer integration in advanced HBM products.

Design and analyze digital and analog circuits for memory products. Lead layout (floor-planning, placement, routing), perform parasitic modeling, SPICE/Verilog simulation, design validation, reticle experiments and tape-out revisions. Collaborate with test, process integration, product engineering, and cross-functional teams to ensure manufacturability, reliability, cost, and time-to-market.

Lead verification architecture and plans for HBM DRAM IP and SoC integration. Drive co-verification with customers, mentor engineers, develop methodology and GenAI tools, and debug pre-/post-silicon issues while proposing scalable verification solutions.

Lead integration of environmental compliance into global capital projects for fabs and facilities. Drive design for air, water, and waste systems, define global design standards, support permitting and risk mitigation, perform design reviews, and leverage AI analytics to improve environmental engineering outcomes across design, construction, and startup.

The Process Integration Engineer will develop advanced interconnect technologies and collaborate on project timelines, while ensuring product performance and quality from development through production.

Lead early-phase transfer of semiconductor products from development to manufacturing by optimizing etch/process modules, managing suppliers and hardware, collaborating with TD and manufacturing, ensuring process safety and metrology, developing process control models, and applying AI/LLM concepts to improve yield, quality, and cost.