Top Tech Jobs & Startup Jobs

Supports Micron’s global policy communications strategy through drafting press releases, quotes, messaging briefs, social media content, event summaries, policy monitoring, copy editing, and cross-functional collaboration. The intern will monitor congressional hearings, think tank events, industry news, and policy developments related to semiconductor and national security issues, while helping amplify policy narratives across integrated communications channels.

Own ESD and latch-up strategies for advanced DRAM and HBM products from early design through high-volume manufacturing. Define requirements and sign-off criteria, enable protection circuits and safe layout practices, lead silicon validation and failure analysis, and correlate pre-silicon assumptions with silicon results. Partner with foundries, design, packaging, reliability, and product teams while mentoring engineers and influencing design methodology.

Develop and implement semiconductor process control solutions using SPC, SQL, data analysis, and AI-assisted methods. Build data queries, reporting systems, and automation to measure process capability, identify variation, and improve manufacturing processes. Extract and cleanse data, detect outliers and missing values, present complex findings, mentor colleagues on statistical methods, and collaborate with global engineering, manufacturing, process development, and information systems teams.

Supports global semiconductor customers by qualifying and routing leads, coordinating cross-functional actions, managing escalations, maintaining operating standards, communicating commercial and product updates, and balancing shipment priorities, risks, and revenue alignment. The role requires enterprise or hyperscaler sales experience, executive communication, quoting and RFQ expertise, demand and supply coordination, commit management, and backlog knowledge.

Leads indirect procurement programs supporting capital construction and facilities operations. Translates strategic objectives into roadmaps, coordinates cross-functional teams, manages risks, budgets, timelines, and stakeholder conflicts, and provides executive reporting through dashboards and scorecards. Applies procurement and construction expertise while driving collaboration, continuous improvement, and technology adoption, including AI tools and business intelligence platforms.

Leads physical design and verification teams developing advanced HBM SoC base-die designs from netlist through GDSII and tapeout. Owns floorplanning, placement, clock-tree synthesis, routing, timing and power closure, physical signoff, IP integration, and post-silicon debug. Partners cross-functionally on PPA, power architecture, packaging, manufacturing, and product delivery. Improves design flows through scripting, automation, and agentic AI/LLM workflows while mentoring engineers and managing resources across projects.

Develop and optimize photolithography processes for advanced 3D DRAM using 365 nm, 248 nm, and 193 nm immersion lithography. Lead module process development, reduce variability and cost, perform root-cause analysis, maintain a pilot manufacturing line, collaborate with integration teams and vendors, and support process transfer to production.

Leads Micron’s global DRAM packaging organization, defining long-term technology strategy and delivering advanced packaging solutions including HBM, 3D integration, heterogeneous integration, and chiplets. The role oversees cross-functional product development through high-volume manufacturing, drives technology investments, develops customer and supplier partnerships, and leads digital transformation using AI, analytics, automation, and engineering productivity initiatives. It also requires building high-performing global teams and influencing business and technology direction.

Develops and prepares semiconductor device layouts and detailed drawings from engineering schematics. Leads major block development, product revisions, floor-planning, signal-planning, and power-planning. Verifies layout data integrity, performs physical verification and root-cause debugging, assigns resources, schedules tasks, and collaborates globally with design, verification, technology development, and CAD teams. Improves layout efficiency through automation, new methodologies, and quality optimization.

Lead semiconductor metrology and process engineering for DRAM manufacturing. Responsibilities include process startup, qualification, optimization, yield improvement, cost reduction, failure analysis, supplier management, audits, equipment and material evaluations, and new product introduction. The role requires operating and analyzing KLA, ASML, Hitachi, and Applied Materials metrology tools, performing photolithography metrology analysis, and using JMP for statistical process control, gauge capability, critical dimension analysis, and designed experiments.