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Lead and govern Risk-Based Process Safety for high-complexity memory manufacturing. Partner with engineering and manufacturing to assess and mitigate process risks, support Management of Change, facilitate hazard analyses and investigations, and provide guidance and reporting on safety trends and program health across global sites.

Lead thin films process development for advanced DRAM: diagnose and resolve process issues, drive yield/cost/productivity improvements, validate and scale new processes/tools/materials, manage supplier quality and audits, and support product ramps.

Develop and optimize dry etch processes for next-generation DRAM, collaborate with integration and process teams, perform root cause and defect analysis, apply statistical methods to improve process capability and manufacturing readiness, and support process transfer and production issue resolution.

Lead development, optimization, and transfer of advanced DRAM wet processes (cleans, etch, plating). Drive technology roadmaps, troubleshoot via root-cause analysis, collaborate cross-functionally and with vendors, and influence strategic process and tooling decisions to enable high-volume manufacturing.

Lead development, startup, and optimization of CMP processes for advanced packaging. Drive yield, cost, and productivity improvements, perform failure analysis and process control, manage complex cross-functional projects, collaborate with vendors, and apply AI/data methods to enhance workflows and manufacturability.

Customer-facing technical leader who engages early with strategic customers to translate workloads into end-to-end Micron memory and storage architectures, influence platform decisions 12–24 months ahead of revenue, secure design wins, and drive pipeline and revenue impact while coordinating cross-functionally for execution and sustainment.

Manage the lifecycle of High Bandwidth Memory (HBM) products, driving development across teams, schedule management, and communication of progress and priorities.

Partner with product owners to translate business problems into scalable data science, ML, AI, and GenAI solutions. Develop predictive, forecasting, optimization, and simulation models; analyze large datasets; build dashboards; deploy models in cloud environments; and contribute to data governance and infrastructure improvements.

The Process Integration Engineer will lead technology development, design experiments, evaluate device performance, and manage projects in advanced memory production for Micron's semiconductor division.

Support and improve advanced packaging assembly processes by diagnosing process issues, performing failure analysis and statistical methods (SPC, FDC, FMEA, 8D), analyzing data to boost yield and quality, partnering with cross-functional and global teams, monitoring trends to increase process capability, and supporting evaluation/qualification of process changes, materials, and vendor solutions.