Top Tech Jobs & Startup Jobs

Serve as global account leader for a hyperscale customer: own revenue and relationships, set multi-year account strategy, influence system architecture, lead cross-functional teams, negotiate LTAs and supply agreements, and drive design wins by aligning product and engineering roadmaps across regions.

Coordinate and own cyber audit execution: manage auditor interactions, collect and validate evidence, govern remediation, and enable engineering teams. Drive AI-enabled audit automation for continuous control monitoring, control validation, remediation tracking, and executive reporting to maintain a continuously audit-ready security posture.

Support R&D of manufacturable wafer bonding technologies: plan and run experiments, analyze data, evaluate equipment and materials, propose process improvements, and use AI and advanced analytics to accelerate process development and improve yield and manufacturability.

The Principal Product Yield Analysis Engineer resolves complex yield issues, performs failure analysis, and collaborates with teams on product reliability and yield improvements.

Architect and deploy hardware emulation environments for next-generation HBM products. Configure and debug large-scale RTL on emulation platforms, create emulation testbenches/transactors, support pre-silicon validation, firmware bring-up, hybrid validation flows, and integrate AI-enabled workflows. Collaborate with design, verification, firmware, and system teams and provide hands-on support during tapeout, bring-up, and customer enablement.

Lead systems-level architecture for next-generation memory solutions (DDR, LPDDR, HBM, CXL). Develop analytical and simulation models to evaluate performance, reliability, power, thermal, and cost tradeoffs. Define cross-layer requirements across DRAM, packaging, modules, controllers, platforms, and system software. Drive roadmaps and architecture recommendations with quantitative analysis, mentor engineers, influence cross-functional teams, and contribute to patents, publications, and standards.

Develop and optimize dielectric thin-film deposition processes (ALD/epitaxy/plasma) for advanced DRAM. Drive DOE/SPC-based experiments, troubleshoot tools, improve uniformity/conformality/quality, lead cross-functional projects, and communicate technical results to meet performance and yield goals.

Lead digital design for HBM-related blocks: specify and implement RTL (Verilog/SystemVerilog), define microarchitecture, perform CDC and timing analysis, apply low-power methodologies (CPF/UPF), support synthesis/STA, collaborate with verification/DFT/physical/CAD teams, and assist post-silicon debug using AI-enabled tools.

Perform hands-on semiconductor process development and optimization for 3D DRAM metals. Partner with cross-functional teams to run experiments, analyze pilot-scale manufacturing data, perform root-cause and failure-mode analysis, and present results. Apply statistical methods and AI/AI-assisted tools to improve process performance and yield.

As an Equipment Maintenance Technician, you will monitor and maintain manufacturing equipment while collaborating with teams to optimize performance, safety, and cleanliness in a semiconductor environment.