Top Tech Jobs & Startup Jobs

Improves semiconductor wafer manufacturing processes through yield, quality, efficiency, throughput, and cost-reduction initiatives. Resolves process and equipment issues, monitors SPC performance, analyzes manufacturing data, executes optimization projects, updates procedures, and collaborates with equipment, operations, process owners, and other stakeholders. The role requires shift flexibility and supports high-volume manufacturing area KPIs.

Evaluate emerging DRAM technologies and their impact on product architectures, perform transistor-level simulations and circuit benchmarking with EDA tools, develop Claude AI automation workflows, analyze technical data, and communicate findings. Collaborate with device, modeling, process integration, and circuit design teams on technology development projects.

Supports and improves semiconductor assembly processes within Micron’s advanced packaging development organization. Diagnoses process issues using failure analysis, FMEA, 8D, SPC, and FDC; analyzes manufacturing data to improve yield, quality, cost, and process capability; collaborates with engineering, operations, suppliers, and global sites; monitors trends; and qualifies process, material, and vendor changes.

The Principal Engineer leads ASIC physical design, focusing on full-chip and block-level implementation, timing closure, low-power design, and ensures successful tape-out across advanced technology nodes.

Implement SoC physical design from netlist to GDSII: floor-planning, placement, CTS, routing, and optimization to meet PPA. Drive MMMC timing closure, integrate complex IP, perform physical signoff (DRC/LVS/IR/EM/timing), support tape-out and post-silicon debug, collaborate across RTL/DFT/packaging/manufacturing, and improve flows via scripting and AI-enabled tools.

Analyze inline defect signals and tool behavior to detect anomalies, quarantine out-of-control tools, implement inspection strategies, and drive continuous improvement through data-driven problem solving. Partner with global teams, refine inspection methods, and use analytics and scripting to optimize process stability and defect detection in high-volume 300mm semiconductor manufacturing.

Lead startup, development, and optimization of wet etch processes for DRAM production. Improve yield, reduce cost, resolve manufacturing issues, collaborate with equipment and integration teams, and drive SPC-based process improvements while meeting project milestones.

Designs and validates analog, digital, and mixed-signal electronic hardware for semiconductor test systems. Responsibilities include component selection, schematic development, PCB layout collaboration, circuit simulation, laboratory testing, debugging, technical documentation, prototype deployment, customer validation, and sustaining engineering. The role also develops scripts and automation to improve design workflows, data analysis, and test efficiency while collaborating with global cross-functional teams.

Leads supplier quality programs for equipment and materials, analyzing performance metrics and driving continuous improvement. Manages 8D corrective actions, root cause investigations, supplier process changes, risk assessments, audits, and implementation verification. Applies IQC, SPC, FMEA, process capability, and statistical sampling methodologies to ensure supplier compliance and manufacturing quality. Partners with global suppliers and manufacturing sites to improve performance and mitigate supply-chain risk.

Contribute to next-generation DRAM technology development by defining design rules, structural requirements, and electrical specifications. Collaborate with process, device, materials, simulation, architecture, circuit design, and quality teams. Maintain integration plans and technical documentation, assess device architectures and scaling approaches, resolve technical issues, and use AI-assisted tools and data-driven methods to support engineering analysis and decision-making.