Top Tech Jobs & Startup Jobs

Evaluate, select, install, modify, upgrade, and maintain vacuum and thin-film tools in a semiconductor cleanroom. Use AutoCAD/SolidWorks for schematics, analyze tool data, manage projects, optimize tool performance and yield, coordinate maintenance and spare parts, implement recovery plans, and comply with ISO 9001:2015 and safety procedures.

Develop and optimize FIB metrology recipes and methodologies for prototype wafers, perform wafer-level process characterization and failure analysis (using FIB/SEM), improve yield, integrate processes for new technology programs, analyze data with JMP or Visual Basic, and present findings to engineering teams.

Develop and implement photolithography processes for next-generation magnetic recording heads, design and run experiments, analyze data to improve yield, qualify new tools, implement process control, and collaborate with cross-functional teams while overseeing process technicians and ensuring manufacturing readiness and safety compliance.

Evaluate, select, install, modify, upgrade, and maintain plating-area semiconductor tools. Use CAD to create schematics, analyze tool data, manage projects and spare parts, improve yield and reliability, and ensure compliance with ISO 9001:2015 and safety procedures in a cleanroom environment.

Designs, implements, and supports network and server infrastructure. Manages network devices, patches, firmware, capacity planning, virtualization (VMWare), Windows and Linux servers, security updates, and vendor/system access. Monitors network health, documents changes, partners with teams on IT projects, and maintains compliance and operational reliability.

Support and optimize day-to-day photolithography manufacturing processes to improve yield and reliability. Design and run experiments, perform SPC/DOE analysis, conduct root-cause investigations, implement corrective actions, and collaborate with cross-functional teams to reduce cost and cycle time.

Lead process integration and wafer-level characterization for next-generation thin film recording head technologies. Perform FIB failure analysis, design experiments, analyze backend performance using JMP/Visual Basic, recommend corrective actions, and present findings to teams while adhering to cleanroom and safety procedures.

Evaluate, select, install, maintain, and optimize plating-area semiconductor equipment; create schematics with CAD; analyze tool data; manage projects; coordinate maintenance to maximize uptime; implement recovery and preventive measures; ensure ISO 9001 compliance and safety; collaborate cross-functionally to improve yield, reliability, and lower costs.

Design, simulate, and validate advanced optical delivery systems for HAMR heads. Lead optical concept development, perform simulations (Lumerical, Tidy3D, COMSOL), run optical characterization and failure analysis, collaborate with process/test teams, and translate innovations into manufacturable product solutions while documenting results and supporting technical reports and invention disclosures.

Responsible for evaluation, selection, installation, maintenance, and optimization of CMP semiconductor tools. Uses CAD software to produce schematics, analyzes tool data, manages equipment projects and spare parts, implements reliability improvements, and ensures uptime and ISO 9001:2015 compliance in a cleanroom manufacturing environment.