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Manage and coordinate multiple projects, vendors, and facility needs; maintain trackers, prepare status reports, assist with procurement and invoice reconciliation, and serve as liaison across facilities, engineering, IT, procurement, and external vendors to keep project deliverables on schedule.

Lead development, qualification, and supplier management for FR4/PCB substrates. Drive DFM/DFT, quality control, failure analysis, reliability testing, and engage in packaging production processes and supplier risk mitigation.

Develop and execute test solutions across characterization, wafer sort, and final test for silicon photonics and semiconductor products. Build ATE test programs (Advantest/Teradyne), optimize test flows for coverage/time/cost, analyze yield data, debug failures, and collaborate with design, product, and operations to enable NPI and high-volume manufacturing.

Lead full-chip and block-level physical implementation for advanced-node ASICs (5nm/3nm), owning floorplanning, placement, CTS, routing, signoff, and power/timing closure while collaborating with RTL, STA, IP, and verification teams to resolve high-speed transceiver implementation challenges.

Lead process development for III-V etching, coating, and related fabrication modules; translate product requirements into process specs and control plans; define tooling and metrology; design and run DOEs to optimize yield and manufacturability; qualify vendors and tools; document and institutionalize processes; collaborate with device, packaging, manufacturing, and external fabs to troubleshoot and scale.

Design and implement front-end digital RTL blocks (SystemVerilog) including high-speed datapath, UCIe adapters, FIFOs, and assertions. Develop micro-architecture, write block-level testbenches, ensure lint/CDC/timing cleanliness, collaborate with DV/backend, and support simulation, emulation/FPGA bring-up and silicon debug.