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Design and implement front-end digital RTL blocks (SystemVerilog) including high-speed datapath, UCIe adapters, FIFOs, and assertions. Develop micro-architecture, write block-level testbenches, ensure lint/CDC/timing cleanliness, collaborate with DV/backend, and support simulation, emulation/FPGA bring-up and silicon debug.

The Director of Silicon Test Engineering will lead test strategy and execution for silicon photonics products, optimizing test solutions and ensuring product reliability. Responsibilities include managing ATE test development, driving yield optimization, and collaborating with cross-functional teams while building a high-performing engineering team.

The role involves designing and optimizing advanced packaging solutions for ASICs, conducting FEA simulations, and collaborating with cross-functional teams to enhance photonics technologies for AI and high-performance computing.

As an IC Package FEA Engineer, you will conduct FEA simulations for advanced packaging solutions, optimize designs, and collaborate with cross-functional teams to enhance reliability and performance in photonic devices.

Lead software integration for high-speed optical transceivers on advanced switch architectures, ensuring automation and system debugging, collaborating with cross-functional teams.

Lead signal integrity analysis for photonic-electronic systems, collaborating with design teams to optimize high-speed data paths and package stack-ups.

Lead end-to-end process design, automation, and continuous improvement across NPI, supply chain, manufacturing, and post-sale support. Drive process discovery, future-state architecture, automation specs, KPI dashboards, governance forums, and change management to improve cycle time, quality, and cost outcomes.

The Director of System Applications Engineering will lead a team for deploying optical transceivers, oversee technical engagement, and resolve complex system issues, influencing product decisions and managing customer relationships for AI networking platforms.

Lead the development of packaged silicon photonics solutions, translating customer needs into technical requirements, while driving cross-functional execution and validation.

The Senior Technical Program Manager oversees silicon tapeouts, advanced packaging, and system integration, ensuring timely delivery while managing schedules and stakeholder communications.