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Owns electromechanical component, subsystem, and production testing from test planning through execution and results. Responsibilities include designing test hardware, fixtures, and tooling; building and activating test setups; operating instrumentation; troubleshooting issues; analyzing and communicating data; improving testing standards; leading multidisciplinary test campaigns; supporting production scale-up; and mentoring team members. The role requires hands-on aerospace electromechanical testing, fabrication, test automation, CAD, analysis, and production test infrastructure development.

Lead end-to-end manufacturing strategy for satellite subsystems from concept through production ramp. Partner with design engineering on DFM, architect scalable production flows, develop tooling and automation, establish production readiness plans, lead first-article builds and flight-hardware integration, model capacity and rate ramps, drive continuous improvement, and mentor manufacturing engineers and technicians.

Leads electrical manufacturing engineering for spacecraft electronics, including DFX reviews, prototype builds, tooling, manufacturing flows, PCBA integration, wire harnessing, and electromechanical assemblies. Establishes manufacturing standards, policies, and capacity strategies; develops automation and MES tools; optimizes production processes; mitigates manufacturability and quality risks; and mentors engineering and technical staff. The role supports transition from prototype to high-rate satellite production and pilots advanced manufacturing technologies.

The Automation & Controls Engineer will collaborate with engineers to develop automation projects, implement production systems, and enhance manufacturing processes for high-volume satellite production.

Design, develop, test, and integrate RF and microwave hardware for satellite communications and software-defined radio systems. Responsibilities include RF circuit and multilayer PCBA design, component selection, environmental qualification, spacecraft integration, debugging, and technical mentorship. The role covers frequencies from UHF through Ka band and involves collaboration with antenna, FPGA, DSP, software, mechanical, and electrical engineering teams.

Design and develop high-performance RF and millimeter-wave MMICs for satellite communications, including power amplifiers, low-noise amplifiers, and RF switches. Own designs from architecture through layout, electromagnetic simulation, tapeout, characterization, and system integration. Optimize performance across power, efficiency, linearity, noise, bandwidth, and robustness while collaborating with RF systems, antenna, packaging, and transceiver teams.

Design and develop high-performance RF and millimeter-wave MMICs, including power amplifiers, low-noise amplifiers, and RF switches, from architecture through tapeout, characterization, and product integration. Perform circuit and electromagnetic simulations, optimize performance, develop test plans, validate hardware, correlate measurements with simulations, and collaborate with systems, antenna, packaging, and transceiver teams on satellite communication products.

Lead the development of production automation for satellite manufacturing, involving design, implementation, and mentorship of engineers while enhancing production reliability and efficiency.

Design and lead advanced ASIC package architectures, especially FC-BGA and MCM solutions, from early trade studies through production. Responsibilities include substrate stack-ups, ball maps, SI/PI, thermal management, signal breakout, material selection, qualification, and assembly optimization. The engineer partners with silicon, RF, and systems teams and manages OSAT and substrate-vendor relationships for high-performance, power-dense mixed-signal and digital SoCs.

Designs advanced ASIC packages, including FC-BGA and MCM architectures, from early trade studies through production. Responsibilities include substrate and ball-map definition, SI/PI and thermal design, high-speed signal breakout, material and assembly selection, vendor management, qualification, and collaboration with silicon, RF, and systems teams. The role focuses on high-pin-count, power-dense mixed-signal and digital SoC packages for high-reliability aerospace applications.