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Lead detailed design of RF circuits, modules, and subsystems for defense/aerospace products. Provide technical leadership, resolve complex manufacturing/test issues, transfer designs to production, and mentor junior engineers while collaborating across teams.

Lead component/parts engineering for military and space products: perform component reviews, qualification testing, obsolescence/PCN assessments, supplier management, NSPAR submissions, MRB support, audits, RCCA/CAR activities, and mentor junior engineers while maintaining PMP documentation and compliance.

Design, analyze, prototype, and qualify rugged RF/microwave electromechanical hardware for defense applications. Own mechanical packaging, EMI/thermal/structural interfaces, verification plans, test support, producibility, and cross-functional collaboration from proposal through production.

Provide technical leadership for RF/microwave product troubleshooting in manufacturing and development, support producibility and design updates, assist engineering projects, collaborate with program management, operations, supply chain, and quality to resolve assembly, test, and integration issues for defense/aerospace programs.

Dual-role FSO/ISSM responsible for NISP compliance and DoD RMF accreditation. Manage eMASS SSPs, conduct risk/vulnerability assessments, maintain DISS/NISS records, oversee physical security (CCTV, access control), administer security training, and liaise with government security agencies.

Lead design and development of ruggedized board-level hardware for defense/aerospace systems. Architect high-speed digital boards (FPGAs, secure processing, PCIe, DDR5, 400G Ethernet), establish design standards, ensure manufacturability and verification, support proposals, and mentor engineering teams through production.

Lead board-level design of ruggedized, high-speed digital hardware from concept through production for defense/aerospace systems. Architect FPGA and CPU-based solutions, ensure signal integrity and manufacturability, establish design standards, support proposals, and collaborate with manufacturing for DFM/DFT.

Lead design, analysis, and testing of rugged electronic module assemblies for aerospace/defense. Perform mechanical packaging, thermal/structural/reliability analyses, create 3D models and drawings, support verification testing, manage BOMs/ECRs/ECOs, and coordinate cross-functional teams from concept to production.

Design, prototype, and test RF/microwave circuits and sub-assemblies. Produce engineering documentation, develop functional specifications, support production transfer, and guide automated product testing while collaborating with cross-functional teams.