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Lead design, analysis, and testing of rugged electronic module assemblies for aerospace/defense. Perform mechanical packaging, thermal/structural/reliability analyses, create 3D models and drawings, support verification testing, manage BOMs/ECRs/ECOs, and coordinate cross-functional teams from concept to production.

Design and develop board-level digital circuits and modules from concept through production, focusing on embedded hardware, high-speed interfaces, FPGA/microprocessor integration, troubleshooting, schematic capture, and collaboration with PCB/CAD/SI and manufacturing teams for rugged aerospace and defense platforms.

Lead RF circuit design from concept through production, perform RF architecture and simulation, characterize and test RF performance, mentor engineers, collaborate on integration, and support customers, suppliers, and manufacturing for defense-grade RF/microwave products.