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Designs, develops, qualifies, and releases custom semiconductor packaging technologies for MEMS-based timing products. Leads package design, development, production ramp, design-of-experiments, OSAT management, prototyping, testing, troubleshooting, and performance, reliability, and quality validation. The role works with leadframe, flip-chip, bumping, substrate-based, ceramic, wafer-level, and multi-chip packages while evaluating thermal, mechanical, electrical, stress, and material characteristics.

Leads the specification, design, development, qualification, and production release of custom semiconductor packaging for MEMS timing products. Responsibilities include developing packaging technologies, managing design of experiments, overseeing overseas OSAT activities, prototyping and testing package designs, ensuring performance and reliability requirements, and troubleshooting package issues. The role requires expertise in semiconductor packaging, flip-chip and bumping technologies, package modeling, materials characterization, and CAD tools.

Serves as a strategic finance partner by leading budgeting, forecasting, long-term planning, financial modeling, business case development, performance analysis, and executive reporting. Develops dashboards and actionable insights, evaluates capital investments, supports cost optimization, monitors financial risks, and ensures compliance with accounting standards and corporate policies. Collaborates with operations, supply chain, R&D, senior leadership, and internal audit to align financial performance with corporate strategy.

Manage an assigned US territory of long-tail accounts to drive customer expansion and revenue growth. Use digital marketing and distributor channels to scale engagement, qualify opportunities, engage engineering and sourcing teams, advance deals toward design-in and wins, maintain pipeline and forecasts, and coordinate with distribution partners for demand generation and opportunity tracking.

Develop, validate, and release production test programs and hardware for ATE and oven-based trimming systems. Lead hardware bring-up, tester correlation, validation, and qualification. Collaborate with product, design, manufacturing, and quality teams to support NPI, optimize test coverage and time, maintain documentation, and drive data-driven yield improvements.

Lead global supply chain strategy, optimizing supplier networks and integrating analytics to enhance operational efficiency while mitigating risks within the semiconductor sector.

The Customer Engineer will provide technical support and solutions, develop product presentations, and support design-in efforts related to semiconductor applications.

The Global Payroll Manager oversees payroll operations across multiple regions, ensuring compliance, managing vendor relations, and leading a team while driving process improvements and analytics for business insights.

Oversee the NPI lifecycle for multiple product families, ensuring successful product launches through collaboration with engineering and operations. Lead a team and drive strategy while managing performance and quality.

Design and improve MEMS devices, analyze their performance, interface with vendors, and collaborate with cross-functional teams to develop products.