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Designs, tests, and debugs RF hardware systems for 5G radio products. Responsibilities include board bring-up, RF characterization, subsystem validation, schematic and PCB development, lab measurements, test planning, cross-functional integration, production qualification, and automation of testing and data analysis using scripts.

Own end-to-end Open RAN integrations between partner CU/DU stacks and Eridan’s RU. Bring up and validate core-to-radio networks, troubleshoot Linux, switching, fronthaul, and RAN configuration issues, and verify latency, uplink, RF, and network performance in laboratory and field environments. Serve as the technical point of contact for integration partners and collaborate with software and R&D teams. The role is approximately 85% lab-based and 15% field-based, with international travel possible.

Design and release high-density multilayer PCBs for robotics hardware, including RF paths up to 10 GHz, FPGA/BGA fanout, DDR4, and high-current power. Responsibilities include stackup design, placement, routing, signal and power integrity, component library creation, vendor collaboration, DFM/DFT, manufacturing support, and design reviews. The role also contributes to PCB standards, workflow improvements, thermal management, and IPC-compliant library processes.

Leads RF hardware systems engineering for radio products, owning architecture, integration, verification, system specifications, and production readiness. Performs hands-on RF debugging and board bring-up while managing and mentoring a small systems engineering team. Translates customer requirements into engineering deliverables, coordinates hardware-software integration, supports qualification activities, and drives manufacturing and vendor readiness. Requires extensive RF systems and end-to-end hardware development experience, including 5G radio architectures and high-volume product deployment.