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Lead advanced semiconductor package architecture, design, simulation, qualification, and production integration. Responsibilities include selecting packaging technologies and OSAT partners, defining layouts and materials, analyzing thermal, mechanical, electrical, and reliability performance, developing assembly processes, resolving yield and qualification issues, and supporting high-volume manufacturing. The role also requires cross-functional technical leadership, supplier collaboration, documentation, and mentoring of junior engineers.

Develop and transfer automated test solutions for radiation-hardened analog ICs using Eagle or Flex testers. Responsibilities include generating test hardware and software, analyzing schematics, debugging test programs, improving test methodologies, supporting production, enhancing yield, and evaluating production readiness. The role also requires statistical analysis, JMP analytics, GR&R studies, transient and spike testing, mentoring junior engineers, and serving as a test hardware and software subject matter expert.

Leads package technology development, R&D, NPI, roadmap execution, OSAT management, qualification, process optimization, and production ramp-up for advanced power semiconductor packages. Oversees materials, assembly subcontractors, DOE, process controls, reliability qualification, design rules, quality issues, customer complaints, and technical adoption programs involving SiP/modules, wafer-level, flip-chip, SiC, and GaN technologies.

Serve as a strategic thought partner to the Power Product Group executive team. Analyze market trends, competitive landscapes, and performance metrics; support long-range planning, commercial strategy, M&A, and technology evaluation. Manage strategic projects, provide data-driven recommendations, facilitate cross-functional alignment, improve operational processes, and create executive-level reports and presentations.

Provides strategic analysis, market and competitive intelligence, project coordination, executive decision support, and cross-functional communication for Renesas’ Power Product Group. The role supports long-range planning, commercial strategy, M&A, technology evaluation, operational initiatives, and executive presentations. Candidates should be strong in quantitative analysis, business problem-solving, project ownership, and executive communication, with semiconductor industry experience.

Leads package technology development, NPI, R&D, OSAT management, qualification, roadmap execution, and budget management for advanced power semiconductor packages. Directs design and development of SiP, power modules, wafer-level, flip-chip, SiC, GaN, DBC, and AMB technologies. Selects materials and manufacturing partners, optimizes processes through DOE, establishes production controls, resolves integration and quality issues, supports production ramp-up, and maintains package design rules and customer adoption programs.

Leads package technology development, new product introduction, R&D, roadmap planning, OSAT/contract manufacturer management, and customer adoption programs. Directs development and qualification of advanced power semiconductor packages, including SiP/modules, wafer-level, flip-chip, SiC, GaN, DBC, and AMB technologies. Establishes design rules, process controls, reliability qualification, production transitions, ramp monitoring, and resolution of process and customer issues.

Leads channel marketing for industrial semiconductor solutions and new product introductions. Develops release and distributor engagement plans, presents to distributors and customers, conducts workshops, supports key-account and ecosystem relationships, identifies solution opportunities, promotes application-focused solutions, and coordinates sales, business development, engineering, marketing, and product teams. Provides regional market intelligence and champions cross-business initiatives focused on building automation, industrial automation, and related industrial applications.

Leads mixed-signal verification and behavioral modeling for PMICs, battery chargers, switching regulators, and analog IP. Develops AMS/DMS verification strategies, SystemVerilog RNM and Verilog-AMS models, coverage plans, and tapeout sign-off processes. Owns debugging of analog-digital issues, convergence problems, model inaccuracies, and simulation bottlenecks. Collaborates with design, systems, CAD, and customer teams, supports silicon validation, documents verification results, and provides technical leadership.

Develops strategic insights and recommendations for Renesas’ Power Product Group. Responsibilities include market and competitive analysis, performance reporting, strategic project management, executive decision support, cross-functional collaboration, operational improvement, and preparation of reports and presentations. The role supports long-range planning, commercial strategy, M&A, and technology evaluation within the semiconductor industry.