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Reposted 2 Hours AgoSaved
In-Office
Chandler, AZ, USA
Senior level
Senior level
3D Printing
Lead and scale site-wide digital design and verification for mixed-signal SoCs. Define verification strategy (SystemVerilog/UVM, formal, AMS/DMS), enforce RTL quality, timing closure, DFT, and sign-off criteria. Drive reuse, automation, metrics-driven verification, and on-time tape-out. Build technical teams, define career ladders, align cross-functionally, and translate product strategy into multi-year capability investments to improve first-pass silicon success and execution predictability.
Top Skills: Ams/DmsCdcDftFormal VerificationFsmLintRtlScanSocStaSystemverilogUvm
Reposted 2 Hours AgoSaved
Hybrid
Austin, TX, USA
Senior level
Senior level
3D Printing
Lead end-to-end execution of strategic customer programs for hyperscaler accounts: manage scope, schedules, NPI, engineering samples, volume ramps, supply coordination, cross-functional alignment, dashboards, risk mitigation, and customer/internal program reviews.
Top Skills: Digital Power VrmsMultiphase ControllersPower MosfetsPower TowersSmart Power StagesVertical Power Stages
Reposted 2 Hours AgoSaved
Hybrid
Dallas, TX, USA
Senior level
Senior level
3D Printing
Lead end-to-end execution of strategic customer programs for hyperscaler accounts: manage scope, schedules, NPI, engineering samples, volume ramps, supply coordination, cross-functional alignment, governance, KPIs, and risk mitigation to ensure on-time delivery.
Top Skills: Capacity PlanningEngineering SamplesMultiphase ControllersNpiPower MosfetsPower TowersSmart Power StagesSupply ChainVertical Power StagesVolume RampVrm
Reposted 2 Hours AgoSaved
Hybrid
San Jose, CA, USA
190K-230K Annually
Senior level
190K-230K Annually
Senior level
3D Printing
Lead end-to-end execution of strategic customer programs for hyperscaler customers: align scope, schedules, and deliverables; manage NPI, engineering samples, and volume ramps; coordinate supply chain and manufacturing; identify and mitigate risks; run cross-functional governance, dashboards, KPIs, and executive-facing status reviews.
Reposted 4 Hours AgoSaved
Hybrid
San Jose, CA, USA
180K-245K Annually
Expert/Leader
180K-245K Annually
Expert/Leader
3D Printing
Lead hardware/software bring-up of analog/mixed-signal and sensor ICs on customer MCUs/SoCs. Write driver-level firmware and application demos, debug full signal-chain issues, build reusable driver frameworks, document architectures and bring-up guides, lead technical integrations with partners, mentor engineers, and support customer lab demos and trade-show deadlines.
Top Skills: Bare-MetalCC++Driver FrameworksEthernetGpioI2CMcuMixed-SignalPythonRtosSensor IcsSocSpiUart
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Reposted 18 Hours AgoSaved
Hybrid
Chandler, AZ, USA
Expert/Leader
Expert/Leader
3D Printing
Lead global technical architecture and full development lifecycle for PMIC and analog/mixed-signal blocks. Collaborate with customers on system requirements, drive verification/DFT strategies, mentor engineers, and ensure production readiness while improving company-wide engineering methodologies and roadmaps.
Top Skills: Analog Ic DesignCmosCmos Process TechnologiesDftLab EvaluationMixed-SignalPmicSi Licon Verification
Reposted 18 Hours AgoSaved
Hybrid
Morrisville, NC, USA
Expert/Leader
Expert/Leader
3D Printing
Lead architecture and full development lifecycle of PMIC and mixed-signal analog blocks from specification through design, simulation, silicon verification, and production readiness. Serve as global technical authority, mentor engineers, collaborate with customers on system requirements, oversee verification/DFT and lab evaluation, and drive company-wide engineering methodology and roadmap improvements aligned with CMOS process trends.
Top Skills: Analog DesignCmosDesign For Test (Dft)Mixed-SignalPmicPower Management CircuitsSilicon Verification
Reposted 18 Hours AgoSaved
Hybrid
Dallas, TX, USA
Expert/Leader
Expert/Leader
3D Printing
Lead architectural evolution and full development lifecycle of PMIC and mixed-signal blocks, provide global technical authority, collaborate with customers on system requirements, oversee verification/DFT and lab evaluation, mentor engineers, and drive company-wide engineering methodology and roadmap improvements.
Top Skills: CmosDesign For Test (Dft)Lab EvaluationMixed-SignalPmicSilicon Verification
Reposted 18 Hours AgoSaved
In-Office
Tempe, AZ, USA
Senior level
Senior level
3D Printing
Lead design and development of advanced package and interconnect methods for power SiP/modules, WLCSP, flip-chip LGA and multi-chip modules. Drive wafer-level processes (Cu RDL, thinning, backside metal), define substrate and interconnect requirements, qualify materials and OSAT/CM processes, run DOE and SPC, resolve process integration issues, and support production ramp and quality for consumer, industrial, and automotive power applications.
Top Skills: Backside Metal DepositBgbmCmCu FsmCu RdlDoeEmbedded DieFetFlip-ChipGlass Carrier BondLgaMulti-Chip ModuleOsatPcb InterfacePower SipSeed LayerSpcStatistical Analysis SoftwareSubstrateTaiko Back GrindingViaWlcsp
YesterdaySaved
Hybrid
Duluth, GA, USA
Expert/Leader
Expert/Leader
3D Printing
Architects, designs, verifies, and optimizes CMOS analog blocks and high-speed DDR5/DDR6 I/O interfaces for custom ASICs. Analyzes silicon ATE and bench data, performs simulations, ensures signal integrity and circuit reliability, and collaborates with digital, systems, verification, validation, and test teams. Provides technical leadership and mentorship, documents designs, and ensures layouts meet analog matching and performance standards while satisfying power, area, and timeline constraints.
Top Skills: AsicCadence MaestroCadence VirtuosoCmosDdr5Ddr6HspiceMatlabExcelSpectre
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