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Expert/Leader
3D Printing
Leads global strategy, business development, customer engagement, product portfolio direction, and revenue growth for Renesas’ hyperscaler and emerging AI segment. Builds relationships with cloud providers and AI companies, identifies market opportunities, drives design wins, translates customer needs into product roadmaps, and coordinates Sales, Applications, Engineering, Marketing, Product Management, and Operations teams. Presents strategy and business outlook to senior leadership while influencing global teams across functions and regions.
Top Skills: AICloud InfrastructureData CentersNetworkingSemiconductor Power ManagementServers
6 Hours AgoSaved
In-Office
Plano, TX, USA
Senior level
Senior level
3D Printing
Defines and validates system-level power solutions for AI servers, telecom, industrial, and server applications. Responsibilities include specifying 48V intermediate bus converter products and IC requirements, developing reference designs and validation platforms, performing power integrity, thermal, and fault-response analysis, creating simulation models and technical documentation, and leading cross-functional teams. The role requires hands-on power electronics expertise, PCB and CAD experience, lab debugging, customer collaboration, and system integration leadership.
Top Skills: 48V Intermediate Bus ConvertersCad ToolsControl Loop TheoryDc-Dc ConvertersIc System IntegrationPcb Schematic And LayoutPower ElectronicsPower IntegrityPspiceSimplisSimulation ModelingThermal Analysis
6 Hours AgoSaved
Hybrid
San Jose, CA, USA
190K-240K Annually
Expert/Leader
190K-240K Annually
Expert/Leader
3D Printing
Architects, designs, and implements digital and mixed-signal ICs from product conception through production release. Leads SoC architecture, partitioning, RTL development, simulation, synthesis, DFT, timing verification, silicon evaluation, circuit debugging, and production test support. Collaborates with global engineering teams, supports customers and applications, documents designs, and defines future technology requirements. Requires extensive semiconductor industry experience and expertise in communication protocols, embedded memories, and mixed-signal development.
Top Skills: AhbAIApbAxiDdr DramDesign For Test (Dft)Ee/Flash MemoryI2CI3CMixed-Signal Ic DesignMtpOtpPacket-Oriented ProtocolsRtlSimulationSoc ArchitectureSpiSramSynthesisTiming AnalysisUartUsb
6 Hours AgoSaved
Hybrid
Duluth, GA, USA
Expert/Leader
Expert/Leader
3D Printing
Designs, verifies, and optimizes CMOS analog blocks and high-speed DDR5/DDR6 I/O interfaces for custom ASICs. Responsibilities include analog Tx/Rx, PLL, signal integrity, reliability, layout matching, simulation, ATE and bench-data analysis, documentation, and cross-functional integration. Provides technical leadership and mentorship while ensuring designs meet performance, power, area, timeline, EM/IR, and aging requirements.
Top Skills: AsicCadence MaestroCadence VirtuosoCmosDdr5Ddr6ExcelHspiceMatlabSpectre
6 Hours AgoSaved
In-Office
San Jose, CA, USA
120K-145K Annually
Senior level
120K-145K Annually
Senior level
3D Printing
Validates and optimizes DDR5 power-management products and memory systems through bench measurements, automation, simulation, and system-level power analysis. Provides technical customer support, develops validation plans and technical collateral, and collaborates with design, test, packaging, and product teams. The role requires expertise in analog and mixed-signal circuits, PMICs, high-speed memory technologies, and automation using LabVIEW or Python.
Top Skills: Ddr5I3CJedecLabviewPmicPythonSpd Hub
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7 Hours AgoSaved
In-Office
Austin, TX, USA
Entry level
Entry level
3D Printing
Develop and evaluate power-management applications for AI and cloud infrastructure. Responsibilities include lab evaluation of control algorithms using FPGAs and microcontrollers, behavioral modeling of DC/DC converters in SIMPLIS or MATLAB, contributing to product requirements, and creating datasheets, performance reports, and application notes. The role requires knowledge of multiphase buck converters, magnetics, control-loop theory, embedded programming, Verilog, mixed-signal ICs, lab equipment, and test automation.
Top Skills: Custom Analog Front EndsDc/Dc ConvertersDigital Multiphase Pwm ControllersFpgaMatlabMicrocontrollersNetwork AnalyzersOscilloscopesSimplisVerilogWaveform Generators
17 Hours AgoSaved
Hybrid
Plano, TX, USA
Senior level
Senior level
3D Printing
Leads end-to-end technical program management for semiconductor power-package NPI programs, from development and qualification through production ramp. Establishes plans, milestones, governance, dashboards, and risk mitigation while coordinating engineering, quality, reliability, supply chain, operations, customers, and global OSAT/CM partners. Drives technical task forces, root-cause analysis, corrective actions, qualification, manufacturing readiness, and schedule recovery. Communicates program health and decisions to senior leadership and supports package technology roadmap execution.
Top Skills: Advanced Interconnect TechnologiesAmbContract ManufacturingDbcDiscrete Fet PackagesDoeFlip-Chip TechnologyGanOsatPmicsPower Management ProductsPower ModulesPower SipSemiconductor NpiSicSmart Power StagesSpcStatistical MethodsVertical Power StagesWafer-Level Technology
17 Hours AgoSaved
In-Office
Goleta, CA, USA
138K-173K Annually
Senior level
138K-173K Annually
Senior level
3D Printing
Develops and executes reliability characterization, qualification, accelerated life testing, failure analysis, acceleration models, and mission-profile lifetime predictions for power semiconductor products. Investigates degradation mechanisms and reliability risks across device, process, design, and manufacturing teams. Provides technical guidance on new semiconductor technologies, publishes peer-reviewed technical work, presents at industry forums, and contributes to JEDEC, AEC, and other reliability standards organizations.
Top Skills: Accelerated Life TestingAecDevice PhysicsEarly Life Failure Rate (Elfr)Failure AnalysisGanJedecMission Profile ModelingPower SemiconductorsSemiconductor ReliabilitySwitching Accelerated Lifetime (Salt)Wide-Bandgap Technologies
17 Hours AgoSaved
Hybrid
Tempe, AZ, USA
Senior level
Senior level
3D Printing
Leads strategic AI and datacenter power package engineering and NPI programs from development through qualification, production readiness, ramp, and volume manufacturing. Establishes program plans, milestones, dashboards, risk mitigation, and governance while coordinating internal engineering, quality, reliability, supply chain, and operations teams with global OSAT and contract manufacturing partners. Directs cross-functional task forces, resolves technical and manufacturing issues, drives corrective actions, and communicates program status and decisions to senior leadership.
Top Skills: AmbDbcDoeFlip-ChipGanPmicsPower ModulesPower SipSemiconductor NpiSicSmart Power StagesSpcVertical Power StagesWafer-Level Packaging
17 Hours AgoSaved
Hybrid
Austin, TX, USA
Senior level
Senior level
3D Printing
Lead complex semiconductor power package engineering and NPI programs from development and qualification through production ramp. Establish program plans, milestones, dashboards, risk controls, and governance while coordinating internal teams and global OSAT/CM partners. Drive technical task forces, root-cause analysis, corrective actions, qualification, reliability, yield, manufacturability, and production readiness. Communicate program health and recovery plans to senior leadership and align resources across engineering, quality, operations, supply chain, and product teams.
Top Skills: AmbContract Manufacturing (Cm)DbcDesign Of Experiments (Doe)Flip-ChipGanNew Product Introduction (Npi)OsatSemiconductor PackagingSicStatistical Process Control (Spc)Wafer-Level Packaging
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