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13 Days AgoSaved
In-Office
Frisco, TX, USA
98K-98K Annually
Senior level
98K-98K Annually
Senior level
3D Printing
Serve as trusted technical consultant for enterprise customers: run value-assessment workshops, recommend Altium/ECAD/PLM solutions, build business cases, create executive content, coordinate cross-functional delivery, and present value to decision-makers. Regular onsite travel to US/Europe.
Top Skills: AltiumEcad SoftwarePcb DesignPlm Integrations
13 Days AgoSaved
In-Office
San Jose, CA, USA
118K-145K Annually
Senior level
118K-145K Annually
Senior level
3D Printing
Manage a major semiconductor account by building stakeholder relationships, qualifying requirements, presenting product roadmaps and demos, driving design-wins, coordinating RFQ responses with internal teams, tracking pipeline and forecasts, and identifying account expansion opportunities while staying current on customer roadmaps and competitive trends.
Top Skills: Analog/Mixed-SignalFoundry TechnologiesMemoryPower ManagementProcessorsRfSocs
Reposted 13 Days AgoSaved
In-Office
Duluth, GA, USA
Senior level
Senior level
3D Printing
Responsible for verifying DDR6 data buffer chips, developing verification plans, test strategies, and optimizing verification environments using UVM methodology.
Top Skills: Uvm Methodology
Reposted 13 Days AgoSaved
In-Office
Plano, TX, USA
Senior level
Senior level
3D Printing
Lead the development of DDR5 and DDR6 PHY solutions, managing a team focused on high-speed memory interfaces, overseeing design and implementation, ensuring compliance with standards, and fostering technical excellence.
Top Skills: Analog/Mixed-Signal DesignCmos ProcessDdr PhyDllHigh-Speed Memory InterfacesPllSignal Integrity
Reposted 13 Days AgoSaved
In-Office
Austin, TX, USA
Expert/Leader
Expert/Leader
3D Printing
The Principal Digital Verification Engineer is responsible for verifying DDR5 Data Buffers, developing verification plans, creating reusable test environments, and leading a team in memory interface product verification for optimal performance and quality.
Top Skills: Ddr5Ddr6Uvm
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Reposted 13 Days AgoSaved
Hybrid
San Jose, CA, USA
150K-185K Annually
Senior level
150K-185K Annually
Senior level
3D Printing
Manage global product marketing for memory interface products targeting AI datacenters. Drive business growth, develop business cases, and collaborate with R&D and sales teams to meet customer needs.
Top Skills: Ai DatacenterBusiness CasesMarketing StrategiesMemory Interface Products
Reposted 13 Days AgoSaved
In-Office
Plano, TX, USA
Senior level
Senior level
3D Printing
The role involves verifying DDR5 Data Buffer chips, developing verification plans, and optimizing test environments while mentoring a team of engineers.
Top Skills: Uvm
14 Days AgoSaved
In-Office
San Jose, CA, USA
230K-260K Annually
Expert/Leader
230K-260K Annually
Expert/Leader
3D Printing
Lead package technology development and NPI for power packaging (SiP/modules, wafer‑level, flip‑chip), manage OSAT/CM relationships, qualify materials/processes, define roadmap and design rules, and ensure production ramp, quality, and customer adoption.
Top Skills: Amb SubstratesCmDbcDiscrete Fet PackagesDoeFlip-ChipGanMulti-Chip ModuleOsatPower ModulesPower SipSicSip/ModulesSmart Power StagesSpcStatistical Analysis SoftwareVertical Power StagesWafer-Level PackagingWire-Bonding
14 Days AgoSaved
In-Office
San Jose, CA, USA
230K-270K Annually
Expert/Leader
230K-270K Annually
Expert/Leader
3D Printing
Define and drive end-to-end embedded firmware architecture for AI cluster scale-up switches. Design low-level firmware for ASIC microcontrollers, hardware-software interfaces, link training, topology discovery, routing, and flow-control. Optimize latency/bandwidth, implement RAS features and secure boot/root-of-trust, and lead SDK/API design for BMC integration (OpenBMC/Redfish). Collaborate with ASIC, RTL, and verification teams and use hardware debug and lab tools to validate high-speed fabric performance.
Top Skills: Bare-MetalCCryptographic Firmware AuthenticationCxlFecFreertosJtagLauterbach Trace32NvlinkOpenbmcOscilloscopePcie Gen5Pcie Gen6Pcie Protocol AnalyzerPhy EqualizationPythonRedfishRtosRuntime AttestationSecure BootSerdesThreadxUalinkZephyr
14 Days AgoSaved
In-Office
Austin, TX, USA
Senior level
Senior level
3D Printing
Senior technical authority defining and governing physical-design architecture and foundry strategy (TSMC) for MCU/SoC products. Leads AI initiatives to reduce MCU development cost, drives physical partitioning, PPA targets, IO and timing requirements, and aligns die-size and KPI goals with system architects and chip leads.
Top Skills: AIMcuPhysical DesignPpaSocTsmc
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