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Lead cross-functional product development for AI processors and systems from concept to delivery. Drive schedules, risks, dependencies, and stakeholder alignment across hardware, software, firmware, validation, manufacturing, and suppliers. Communicate technical status to executives and coordinate structured product development processes in a hybrid, collaborative environment.

Design board-level routing studies, mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Collaborate with signal integrity, power integrity, mechanical, and system teams to develop PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling. Apply engineering judgment to evaluate tradeoffs and improve workflows using automation and data analytics.

Contract HR Project Manager to operationalize People programs (promotions, performance, merit, surveys). Build plans, trackers, timelines, align stakeholders (HR, Comp, Analytics, Payroll, business leaders), track progress, surface risks, and ensure execution of cyclical high-impact work in a fast-moving environment. Hybrid role based in Santa Clara, Austin, or Toronto.

The engineer will focus on pre-silicon verification of DFD logic in AI SoCs, developing environments, analyzing coverage gaps, and automating testing flows.

Design and specify next-generation CPU networking for datacenter and automotive/robotics targets. Work at the intersection of NoC, performance modeling, and RTL to guide architecture, collaborate with hardware, software, and systems teams, and contribute to datacenter networking and early-stage automotive/robotics networking scoping and specifications.

Lead the development of CPU core-level test generators for RISC-V processors, overseeing validation strategies and guiding a small team while staying hands-on with implementation.

The CPU Core Unit Lead will develop next-generation CPU RTL, define microarchitecture specifications, oversee design quality, mentor junior engineers, and use AI tools to enhance design processes.

Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.

The Timing Engineer will perform static timing analysis, optimizing paths and constraints to ensure chip performance while collaborating with various engineering teams.

Lead EM and IR-drop simulations ensuring robust power delivery and signal integrity for high-performance ICs. Collaborate with teams on power grid strategies and support EMIR sign-off across chip hierarchy.